| Allicdata Part #: | ATS-17G-176-C1-R0-ND |
| Manufacturer Part#: |
ATS-17G-176-C1-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X15MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17G-176-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.13866 |
| 30 +: | $ 3.05361 |
| 50 +: | $ 2.88401 |
| 100 +: | $ 2.71435 |
| 250 +: | $ 2.54470 |
| 500 +: | $ 2.45987 |
| 1000 +: | $ 2.20541 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.56°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are components that are used in electronics such as computers and other electronic devices, in order to dissipate the heat generated by electronic components. The ATS-17G-176-C1-R0 heat sink is a remarkable example of this technology. This heat sink has been designed to be an efficient and effective cooling solution for high powered applications.
The ATS-17G-176-C1-R0 heat sink is constructed with aluminum fin-stacks and an aluminum base. The fin-stacks increase the surface area which helps to dissipate heat. The aluminum base also helps to provide a stable and solid base for the heat sink, preventing bending or warping. It is lightweight, yet durable, and can survive the rigors of high-powered environments.
The heat sink has been designed to offer an optimal balance between cooling and performance. It features an insulated, black type anodized aluminum top plate that helps to reduce heat buildup and protect delicate components. It also features high-density fins and heat-dissipating channels which allow for improved air circulation and the efficient dissipation of heat.
The ATS-17G-176-C1-R0 heat sink is designed to provide efficient cooling to a range of components, such as integrated circuits, microprocessors, amplifiers, analog-to-digital converters, voltage regulators and other high-power electronic components. It is also suitable for use in a variety of temperatures, as it is designed to operate at temperatures ranging from -20°C to 175°C.
The working principle of the ATS-17G-176-C1-R0 heat sink is based on the natural process of convection. Heat is generated within the component, and the heat sink helps to move the heat away from the component by transferring it to the atmosphere. The fins of the heat sink help to dissipate the heat into the atmosphere, and the top plate helps to reduce the temperature of the air near the component. As the air near the component is cooled, the component itself cools down.
In addition to being used to cool components, the ATS-17G-176-C1-R0 heat sink can also be used for other purposes, such as helping to reduce noise from electronic components. The heat sink can absorb and dissipate the energy, which can help to reduce noise caused by vibration and resonance.
Overall, the ATS-17G-176-C1-R0 heat sink is an efficient and effective cooling solution for a range of applications. It offers an optimal balance between cooling and performance, and can be used to cool a range of components. It is also lightweight and durable, and can be used in a variety of temperatures. In addition, it is also suitable for use in reducing noise from electronic components.
The specific data is subject to PDF, and the above content is for reference