| Allicdata Part #: | ATS-17G-197-C3-R0-ND |
| Manufacturer Part#: |
ATS-17G-197-C3-R0 |
| Price: | $ 3.51 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17G-197-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.18591 |
| 30 +: | $ 3.09981 |
| 50 +: | $ 2.92774 |
| 100 +: | $ 2.75549 |
| 250 +: | $ 2.58325 |
| 500 +: | $ 2.49714 |
| 1000 +: | $ 2.23882 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.05°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions are vital for ensuring the efficient operation of almost all electronic devices. In order to maximize the performance of applications that generate heat, the use of heat sinks is critical. The ATS-17G-197-C3-R0 is a highly efficient and reliable thermal-heat sink ideal for use in a wide range of applications, from personal computing to data-center storage.
The ATS-17G-197-C3-R0 is a thermal-heat sink that is designed to dissipate heat quickly and evenly across multiple modules. It is constructed from aluminum alloy which offers efficient heat transfer between the aluminum heat sink and the module in which it is mounted. It offers a range of thermal conducting capabilities which make it suitable for various application fields, including industrial, automotive, medical, aerospace, military, and consumer electronics. The ATS-17G-197-C3-R0’s design also allows it to fit a wide range of modules without the need for custom mounting solutions.
The ATS-17G-197-C3-R0 is a high-performance thermal-heat sink that is designed to dissipate heat quickly and evenly across multiple modules. It utilizes aluminum alloy to provide excellent heat dissipation while also reducing the total mass of the thermal-heat sink. The ATS-17G-197-C3-R0 is designed to be extremely lightweight and durable, making it ideal for use in industrial and automotive applications. The ATS-17G-197-C3-R0 also features a unique finned design, which helps to increase the amount of surface area available for heat conduction, thus allowing for greater heat dissipation capabilities.
At the heart of the ATS-17G-197-C3-R0 is a special heat-pipe technology which helps to transfer heat away from the modules quickly and efficiently. This helps reduce system operating temperatures, resulting in improved overall system performance. The ATS-17G-197-C3-R0’s design also includes an optimized fin design for increased airflow. The unique fin design helps to maximize the amount of air that can flow through the heat sink, resulting in better cooling and improved system performance.
The ATS-17G-197-C3-R0 is designed to be versatile and reliable in a wide range of applications. It is designed to fit in many standard modules, including RAM modules, CPUs, GPUs, and other integrated circuit packages. The ATS-17G-197-C3-R0’s design also allows it to be used in many different thermal management applications, including cooling computer processor and graphics cards, as well as cooling electronic systems such as hard drive and network servers.
In conclusion, the ATS-17G-197-C3-R0 is a highly efficient and reliable thermal-heat sink that is designed for use in a wide range of applications. It is constructed from aluminum alloy which offers efficient heat transfer, and the innovative finned design maximizes airflow for improved cooling. Its heat-pipe technology quickly transfers heat away from the modules, resulting in improved performance. These features make the ATS-17G-197-C3-R0 an ideal choice for a variety of thermal management applications.
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