ATS-17G-20-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-17G-20-C3-R0-ND

Manufacturer Part#:

ATS-17G-20-C3-R0

Price: $ 4.67
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X54X25MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-17G-20-C3-R0 datasheetATS-17G-20-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.19895
30 +: $ 3.96543
50 +: $ 3.73225
100 +: $ 3.49896
250 +: $ 3.26570
500 +: $ 3.03243
1000 +: $ 2.97412
Stock 1000Can Ship Immediately
$ 4.67
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.126" (54.01mm)
Width: 2.126" (54.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.21°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management has become an increasingly important consideration for electronic systems, and the application and working principles of ATS-17G-20-C3-R0 have made it a popular choice in the thermal management field. As a heat sink, ATS-17G-20-C3-R0 is specifically designed to help reduce the temperature of electronic systems. This type of thermal management solution is commonly used in devices such as computers, telecommunications equipment, and other electronic components that must maintain a certain operating temperature.In order to maximize thermal efficiency, ATS-17G-20-C3-R0 modules are designed to dissipate heat evenly. The conductive material used is aluminum, which helps increase heat dissipation from the module and also provides excellent structural strength. The aluminum is also anodized to make the module corrosion-resistant, ensuring that the module can withstand harsh environments without losing performance or reliability. The main purpose of ATS-17G-20-C3-R0 is to act as an efficient heat sink for electronic systems. In order to achieve this, the module utilizes a unique cooling system known as “opposed pattering”. This pattern includes two layers of fins, placed in such a way that air is able to flow easily between them. This allows for more efficient transfer of heat from the processor to the fins, where it can be dissipated more easily. By using this type of patterning, the ATS-17G-20-C3- R0 is able to provide superior cooling capabilities compared to other types of heat sinks.The ATS-17G-20-C3-R0 also utilizes a special type of fan-blade design, which helps to increase air movement and cooling efficiency. This fan design ensures that the module can keep its temperatures low without creating too much noise, as well as providing efficient and quiet airflow. In addition, the ATS-17G-20-C3-R0 includes built-in thermal sensors that provide real-time feedback regarding the status of the system. These thermal sensors allow the module to monitor temperatures and take the appropriate action if temperatures begin to rise. This ensures that the module is able to keep the system running smoothly and optimally, even in the most demanding conditions.Overall, the ATS-17G-20-C3-R0 is an excellent solution for thermal management in a wide variety of applications. Its efficient design and innovative features make it an ideal choice for helping to reduce operating temperatures and ensure that electronic systems are running optimally. By providing reliable performance and superior cooling capabilities, ATS-17G-20-C3-R0 is an ideal choice for those looking for an efficient and affordable thermal management solution.

The specific data is subject to PDF, and the above content is for reference

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