| Allicdata Part #: | ATS-17G-27-C1-R0-ND |
| Manufacturer Part#: |
ATS-17G-27-C1-R0 |
| Price: | $ 5.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X12.7MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17G-27-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.39028 |
| 30 +: | $ 5.09061 |
| 50 +: | $ 4.79128 |
| 100 +: | $ 4.49177 |
| 250 +: | $ 4.19232 |
| 500 +: | $ 3.89287 |
| 1000 +: | $ 3.81801 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.23°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
A heat sink is a device designed to help dissipate heat generated by CPUs, GPUs, and other computer components. One of the most efficient heat sinks available is the ATS-17G-27-C1-R0. This device is a great choice for many applications due to its highly efficient design and heat transfer capability. In this article, we will take a look at the application field and working principle of the ATS-17G-27-C1-R0 heat sink.
Applications
The ATS-17G-27-C1-R0 can be used in a variety of applications, including gaming PCs, home servers, and scientific computing systems. The device can also be used in embedded systems where heat dissipation is a priority, such as communications systems. Additionally, the ATS-17G-27-C1-R0 is suitable for use in high-performance computing and large-scale enterprise computing applications. It is also ideal for cooling high-performance processors, and can be used in environments that require restricted physical size and minimal acoustic noise.
Working Principle
The ATS-17G-27-C1-R0 uses a combination of convection and conduction to efficiently dissipate heat. The device uses an aluminum fin design with a combination of fan blades and a high-pressure power fan. As the fan rotates, it creates an airstream which helps to dissipate heat away from the CPU core to the fins. At the same time, the aluminum fins are designed to transfer the heat away from the processor to the air around the device. The combination of these two forces ensures that the ATS-17G-27-C1-R0 will effectively dissipate heat, regardless of the processor temperature.
Compatibility
The ATS-17G-27-C1-R0 is designed to work with a variety of CPUs and GPUs, including Intel and AMD processors. The device is also compatible with a variety of motherboards, RAM modules, and other computer peripherals. Additionally, the device is designed for quiet operation, making it ideal for use in high-end gaming setups, home entertainment systems, and any other environment where acoustic noise can be an issue.
Durability
The ATS-17G-27-C1-R0 is designed for long-term use, even in the toughest of conditions. The device is constructed from a high-grade aluminum alloy that is resistant to corrosion, oxidation, and other long-term environmental factors. The device also features a fan blade design that creates a strong air flow and minimal acoustic noise. This combination will help ensure that the device remains stable and effective for years of reliable performance.
Conclusion
The ATS-17G-27-C1-R0 is an excellent choice for anyone looking for a highly effective heat sink. The device is suitable for use in a variety of applications, from gaming PCs to high-performance servers and embedded systems. Additionally, the device is compatible with a variety of CPUs and GPUs, and is designed for long-term use. This combination of features make the ATS-17G-27-C1-R0 an ideal choice for anyone looking for a reliable, efficient heat sink.
The specific data is subject to PDF, and the above content is for reference