| Allicdata Part #: | ATS-17G-28-C3-R0-ND |
| Manufacturer Part#: |
ATS-17G-28-C3-R0 |
| Price: | $ 7.48 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X15MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17G-28-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 6.73218 |
| 30 +: | $ 6.35796 |
| 50 +: | $ 5.98387 |
| 100 +: | $ 5.60990 |
| 250 +: | $ 5.23590 |
| 500 +: | $ 4.86191 |
| 1000 +: | $ 4.76841 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.62°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are a necessary component in many electronics systems, as they provide cooling to dissipate the high levels of heat generated by the circuit’s components. The ATS-17G-28-C3-R0 is a popular thermal heat sink from ATS Technologies. This article will look at the application fields and working principle of ATS-17G-28-C3-R0 thermal heat sinks.
The ATS-17G-28-C3-R0 is a high-efficiency thermal heat sink designed for high-power applications. These thermal heat sinks are ideal for use in industrial and commercial computer systems, as well as medical, telecom, automotive, and aerospace applications. This thermal heat sink utilizes an innovative, fin-stack design that increases both cooling efficiency and surface area. This fin-stack design is optimized to provide superior cooling while still offering a lightweight and compact design to fit in tight spaces.
The ATS-17G-28-C3-R0 features a copper-plated aluminum base with ceramic-based thermal interface material (TIM) to provide maximum heat dissipation. This thermal heat sink utilizes an active heatsink fan to achieve optimal cooling performance. The fan operates using a two-wire control signal, allowing it to be mounted directly to the thermal heat sink. The ATS-17G-28-C3-R0 also features a heat-pipe design that enables improved circulation and cooling within the system.
In order to understand the working principle of the ATS-17G-28-C3-R0 thermal heat sink, it is important to look at the components that make up the unit. The ATS-17G-28-C3-R0 contains the following components: a fan, heat-pipe, heat sink fins, TIM, and a copper-plated aluminum base. The fan is responsible for drawing air through the heat sink fins, which increases surface area and cooling efficiency. The heat pipe is responsible for transferring heat away from the components, and back to the copper-plated aluminum base. The thermal interface material (TIM) is responsible for providing an optimal thermal connection between the heat pipe and components. This heat transfer is then dispersed throughout the system for maximum cooling performance.
The ATS-17G-28-C3-R0 thermal heat sink offers superior cooling performance for a variety of applications. It is a great solution for applications where space is at a premium, as its lightweight and compact design allows for easy installation. Additionally, its high efficiency and superior thermal performance make it an ideal solution for industrial, commercial, and aerospace applications. The ATS-17G-28-C3-R0 is a reliable and cost-effective thermal heat sink, and an excellent choice for systems that require high-efficiency heat management.
The specific data is subject to PDF, and the above content is for reference