ATS-17G-56-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-17G-56-C3-R0-ND

Manufacturer Part#:

ATS-17G-56-C3-R0

Price: $ 3.77
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 35X35X15MM L-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-17G-56-C3-R0 datasheetATS-17G-56-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.42405
30 +: $ 3.33123
50 +: $ 3.14622
100 +: $ 2.96113
250 +: $ 2.77603
500 +: $ 2.68350
1000 +: $ 2.40589
Stock 1000Can Ship Immediately
$ 3.77
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.378" (35.00mm)
Width: 1.378" (35.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 17.86°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are essential components for safely and efficiently cooling electronic components and systems. The ATS-17G-56-C3-R0 is designed to meet the needs of high power devices which require adequate cooling for reliable operations. This article will discuss the application field and working principle of the ATS-17G-56-C3-R0.

Application Field

The ATS-17G-56-C3-R0 is a high-end thermal solution designed for applications with extreme temperature variations. This device is ideal for use in industrial applications such as welding, laser cutting, etc. It is constructed with a high-conductivity aluminum alloy which provides excellent thermal characteristics. Additionally, the ATS-17G-56-C3-R0 can also be used in automotive, medical, and other general electrical systems.

Working Principle

The ATS-17G-56-C3-R0 utilizes a finned heat sink design to dissipate heat away from sensitive components. The device works by exposing a large surface area for heat to transfer from the device into the air, without having to increase the air circulation in the environment. This design increases thermal conduction by increasing the contact between the fins and the components.

The fins are aligned in a radial pattern which helps to draw heat away from the source point and disperse the heat into the air, providing a more efficient transfer of heat. Additionally, the reinforced aluminum alloy provides excellent thermal conductivity, which helps to further optimize heat transfer. This design also allows for a smaller overall footprint, which makes the ATS-17G-56-C3-R0 ideal for applications where space is a factor.

The ATS-17G-56-C3-R0 also features an integrally molded spring clip which enables the fins to be firmly attached to the device, ensuring a secure fit and effective heat transfer. Additionally, the device is equipped with a mounting plate which allows for easy installation in tight spaces.

In summary, the ATS-17G-56-C3-R0 is a high-end thermal solution designed for applications requiring reliable and efficient cooling. The device utilizes a finned design and high-conductivity aluminum alloy to efficiently transfer heat away from sensitive components, making it an ideal choice for a variety of industrial, automotive, medical, and other applications.

The specific data is subject to PDF, and the above content is for reference

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