| Allicdata Part #: | ATS-17G-61-C3-R0-ND |
| Manufacturer Part#: |
ATS-17G-61-C3-R0 |
| Price: | $ 3.77 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17G-61-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.42405 |
| 30 +: | $ 3.23358 |
| 50 +: | $ 3.04340 |
| 100 +: | $ 2.85314 |
| 250 +: | $ 2.66293 |
| 500 +: | $ 2.47272 |
| 1000 +: | $ 2.42517 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 22.07°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal – Heat Sinks is an expansive categorization of products that are used to dissipate heat from a given object or area in order to maintain a desired temperature. The ATS-17G-61-C3-R0 is a type of Heat Sink that is a great choice for cooling a range of electronic devices. This article will explore the field of application and working principle of this cooling component.
The ATS-17G-61-C3-R0 is a standard-sized, aluminum-finned Heatsink. It features a simple design offering realistic performance value in a variety of thermal applications, known for superior reliability. Due to its size, it can fit in many different applications due to size allotment, such as, small or large devices. When combined with a high-efficiency fan, it can be used for a multitude of applications, but can be particularly effective for cooling electronic devices.
This Heatsink can handle a wide range of temperatures, making it suitable for environments of various thermal attributes. Normally, this heatsink can be used with other components and other parts such as capacitors, transistors, or inductors. In all, its cooling efficiency increases with its size so most frequently, larger components require more powerful Heatsinks in order to efficiently dissipate heat.
In terms of the working principle, this Heatsink utilizes a conduction-based process where aluminum fins act as a conducting medium. Heat is transferred from the heat source to the aluminum fins via conduction. After that, air is blown across the fins using a fan. This creates a natural convection process where the hot air is expelled out, bringing in cool air and further dissipating heat from the Heatsink. The fins, air flow, and fan speed are all key elements of a Heatsink’s engineering that affect the thermal performance.
The ATS-17G-61-C3-R0 specifically is designed for cooling board-level components, such as, VRM, Voltage Regulators, Chipsets, and ICs. For a designer, the combination of size, optimum design-rules, easy mounting, and efficient transfer of heat makes this heatsink unique and an excellent choice. It fits into standard fan-slots on motherboards and hence, is easy to mount. Additionally, for in-system thermal control, advanced fan control electronics with various controlling options offers easy integration.
In conclusion, the ATS-17G-61-C3-R0 is an high-performance, thermally efficient Heatsink that works on the basis of conduction and convection mechanisms. Its aluminum fins greatly aide the process of heat transfer and its simple, yet rugged design allows for easy integration into various applications and environments. It can handle a wide range of temperatures and is useful for cooling board-level components, such as, VRM, Voltage Regulators, Chipsets, and ICs.
The specific data is subject to PDF, and the above content is for reference