ATS-17G-95-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.181" (30.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.40°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks: ATS-17G-95-C3-R0 Application Field and Working Principle

The ATS-17G-95-C3-R0 is an ultra-efficient, economical thermal-heat sink of the highest quality available. It is designed to provide superior thermal control for a range of applications, from mission-critical medical devices to high-performance military computing systems. In this article, we\'ll look at the application fields and working principles of this heat sink.

Application Fields

The ATS-17G-95-C3-R0 thermal-heat sink is suitable for a wide range of applications. This includes medical devices, such as X-ray machines, CT scanners, and blood chemistry analyzers; military equipment, such as avionics, communications systems, and weapon systems; and computing equipment, such as servers, workstations, and data storage systems. In each of these cases, ATS-17G-95-C3-R0 provides superior thermal protection for critical components, ensuring their safe and reliable operation.

Working Principle

The ATS-17G-95-C3-R0 thermal-heat sink works using a combination of heat absorption, conduction, and dissipation. Heat absorption is the process of employing a material with higher thermal efficiency than air to absorb heat from other components. The ATS-17G-95-C3-R0 uses a highly thermally efficient aluminum extrusion to absorb heat from components.Heat conduction is the process of transferring heat from the external surface to the center of the device. The ATS-17G-95-C3-R0 uses a high-performance direct-contact heat pipe to effortlessly transfer heat to the center of the device.Heat dissipation is the final step in the cooling process, and it is the process of emitting heat from the device. The ATS-17G-95-C3-R0 heat sink is designed to quickly dissipate heat, using an optimized fin array and air circulation.

Conclusion

The ATS-17G-95-C3-R0 thermal-heat sink is an excellent choice for a wide range of applications. Its combination of efficient heat absorption, conduction, and dissipation make it one of the highest quality thermal-heat sinks available. With a robust design and superior thermal control, the ATS-17G-95-C3-R0 ensures reliable cooling for mission-critical systems.

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