ATS-17H-100-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	8.69°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks are an essential component for many applications as it helps to cool down and disperse heat from electronics. The ATS-17H-100-C1-R0 is a surface-mount thermal heat sink, specifically designed for applications that require narrow, lightweight, and low profile heat dissipation solutions. This heat sink is typically used in consumer electronics applications such as notebooks, tablets, hand-helds devices, and cell phones.The ATS-17H-100-C1-R0 features a rugged and sturdy aluminum alloy construction with a hard-anodized finish that provides protection against corrosion. The heat sink also boasts a lower thermal resistance value for improved heat transfer performance. The fins are specifically designed to provide a heightened surface area, thus allowing for improved heat dissipation. This heat sink is also tested for air flow performance to ensure maximum cooling efficiency.In terms of dimension, the ATS-17H-100-C1-R0 measures 17mm in length and 16.26mm in width. The height is only 1.4mm, making it one of the most compact heat sinks on the market. Furthermore, it requires minimal mounting space for installation and has a weight of only 2.35g, enabling its use in various devices. The ATS-17H-100-C1-R0 Heat Sink works achieve heat dissipation through the process of convection.put simply, it works by providing a large surface area that allows heat to be absorbed from the electronic component. This absorbed heat is then dispersed throughout the environment via air flow. The taller fins allow for more air to contact the surface of the sink, which increases the sink\'s cooling capabilities. This is done by providing an increased area for the hot air to travel through. The increased area allows for more heat to be dispersed which ultimately reduces the overall temperature of the electronic components. Due to its small and low profile form factor, the ATS-17H-100-C1-R0 is also ideal for applications that require minimal space. Additionally, due to its sturdy aluminum alloy construction, it can withstand harsh environments and operate in high-temperature ranges with superior performance and stability.Overall, the ATS-17H-100-C1-R0 Heat Sink is an excellent choice for cooling of heat-sensitive electrical components. Its small size, light weight, and low profile make it ideal for various consumer electronics applications. With its improved heat dissipation performance, its rugged construction, and its higher surface area that facilitates air flow, this heat sink is an excellent choice for any application that requires a reliable and efficient cooling solution.

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