ATS-17H-111-C1-R1 Allicdata Electronics
Allicdata Part #:

ATS-17H-111-C1-R1-ND

Manufacturer Part#:

ATS-17H-111-C1-R1

Price: $ 5.45
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 60X40X9.5MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-17H-111-C1-R1 datasheetATS-17H-111-C1-R1 Datasheet/PDF
Quantity: 1000
10 +: $ 4.90455
30 +: $ 4.63176
50 +: $ 4.35935
100 +: $ 4.08694
250 +: $ 3.81448
500 +: $ 3.54201
1000 +: $ 3.47390
Stock 1000Can Ship Immediately
$ 5.45
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Rectangular, Fins
Length: 2.362" (60.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.374" (9.50mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 26.72°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management solutions such as the ATS-17H-111-C1-R1 heat sink are incredibly important in the effort to ensure proper function of electronics and other high-performance machinery. Heat sinks play an integral role in supporting a stable operating temperature, enabling more efficient and prolonged operations even in the face of remote operation and other usage scenarios which may place extra heat load on the device.

The ATS-17H-111-C1-R1 heat sink is designed for applications which experience higher than normal heat loads. Often used for remote or long duration operations, the heat sink is composed of four heat fins made of highly conductive aluminum. This maximum surface area helps to quickly transfer heat away from the component, which can save an application from overheating and potential hardware failures.

The ATS-17H-111-C1-R1 heat sink also has added a unique mechanical design which uses specially designed conduction plates. This can reduce the contact resistance between the element and the heat sink, allowing for higher thermal efficiencies. Heat is quickly absorbed by the heat sink and removed with air convection, ensuring that no amount of heat is left unchecked to linger in the system.

The ATS-17H-111-C1-R1 heat sink is also designed for mounting horizontally, allowing it to catch any possible hot airflow from being generated co-located components. The design also provides greater flexibility when installing, since the heat sink will not need any additional height clearance or adjustment of components around the heatsink for it to be properly installed.

In terms of thermal characteristics, the ATS-17H-111-C1-R1 heat sink offers improved compliance when compared to traditional heat sinks, due to its increased surface area and conduction plates. With a thermal resistance of up to 0.94 K/W, this treatment helps to maximize cooling and heat transfer away from the device, keeping the device running properly and preventing thermal damage over time.

These features make the ATS-17H-111-C1-R1 heat sink ideally suited to a variety of applications, such as rugged electronic equipment and remote control systems. The heat sink can provide reliable cooling in these environments, and can be used in any system with high heat loads. With a sturdy design and robust thermal performance, the ATS-17H-111-C1-R1 heat sink can provide cooler, more reliable operation even in the most extreme conditions.

The specific data is subject to PDF, and the above content is for reference

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