| Allicdata Part #: | ATS-17H-115-C1-R0-ND |
| Manufacturer Part#: |
ATS-17H-115-C1-R0 |
| Price: | $ 3.23 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17H-115-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.93643 |
| 30 +: | $ 2.85705 |
| 50 +: | $ 2.69829 |
| 100 +: | $ 2.53953 |
| 250 +: | $ 2.38085 |
| 500 +: | $ 2.30148 |
| 1000 +: | $ 2.06339 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.31°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management systems are vital components of many electronic applications used in modern electronic products. Thermal management system components control and dissipate heat generated from electrical devices. Heat sinks are the material, usually metal, which are used to help dissipate this heat. An ATS-17H-115-C1-R0 heat sink is a type of thermal component used in many electronic devices to accomplish this task.
The ATS-17H-115-C1-R0 heat sink is a lightweight and energy-efficient heat sinking solution that is designed to dissipate heat generated from high-powered electronic components. It consists of an extruded aluminum body with fins that are oriented at a 45-degree angle to generate an increased surface area for maximum heat dissipation. These carefully designed fins enable air to pass easily through them, creating a strong air flow for greater heat removal. The thermally conductive material that is used in the body of the heat sink also increases the efficiency of heat transfer. The heat sink also features a threaded base plate for direct mounting, making installation easy.
The ATS-17H-115-C1-R0 heat sink is widely used in a variety of electronic applications, especially those that involve the use of high-powered components. Examples include:
- Computers – The ATS-17H-115-C1-R0 heat sink is widely used in desktop and laptop computers for cooling of the processor and other components.
- Laser technology – Heat generated from laser diodes, transceivers, and receivers can be efficiently dissipated with the use of an ATS-17H-115-C1-R0 heat sink.
- Industrial applications – The ATS-17H-115-C1-R0 heat sink is a dependable choice for cooling components in industrial equipment such as CNC machinery, 3D printers, and industrial motors.
The working principle of the ATS-17H-115-C1-R0 heat sink is simple and straightforward. Heat is generated by the electronic components in the device, and this heat needs to be taken away or dissipated in order for the device to function accurately. The ATS-17H-115-C1-R0 heat sink is designed with carefully constructed fins that enable a strong air flow to pass through them, which, in turn, dissipates the heat away from the electronic components and out of the system. The material of the heat sink also encourages efficient thermal conductivity, meaning the heat is spread over a greater surface area, assisting with the removal of the heat.
In summary, the ATS-17H-115-C1-R0 heat sink is an energy-efficient and lightweight solution for cooling high-powered components in a variety of electronic applications. Its design enables effective air flow to pass through the fins and dissipate the heat away from the device. This helps to ensure the accuracy and performance of the electronic system. The ATS-17H-115-C1-R0 heat sink is an invaluable thermal management component in many modern electronic applications.
The specific data is subject to PDF, and the above content is for reference