ATS-17H-12-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-17H-12-C1-R0-ND

Manufacturer Part#:

ATS-17H-12-C1-R0

Price: $ 3.48
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 50X50X12.7MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-17H-12-C1-R0 datasheetATS-17H-12-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.16197
30 +: $ 3.07671
50 +: $ 2.90581
100 +: $ 2.73489
250 +: $ 2.56397
500 +: $ 2.47851
1000 +: $ 2.22211
Stock 1000Can Ship Immediately
$ 3.48
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.969" (50.00mm)
Width: 1.969" (50.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 15.84°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks

The ATS-17H-12-C1-R0 is a cost effective, high performance thermal management device designed to meet the needs of a wide variety of applications. This heat sink features a stainless steel body with a copper base for optimal thermal operation. The large base area ensures maximum conductivity while still providing a low profile for a variety of mounting configurations. The heat sink includes an airflow baffle which ensures the best possible thermal performance and a high efficiency fan to provide superior cooling for high power components.

Application Field

The ATS-17H-12-C1-R0 heat sink is ideal for use in a wide variety of applications, such as medical, industrial, automotive, and consumer electronics. The versatility of this heat sink allows it to be used for high power components in hydraulic systems, commercial lighting, and even in telecommunications systems. This heat sink can also be used as a heat spreader in a variety of applications. The versatility of this heat sink makes it an ideal choice for thermal management in many applications.

Working Principle

The ATS-17H-12-C1-R0 heat sink uses a thermal conductivity rating of 0.9 W/m.K which allows for efficient heat transfer between the heat source and the aluminum dissipating body. The copper base of the heat sink provides excellent heat transfer from the heat source to the aluminum body. The large base area ensures maximum conductivity while still providing a low profile for a variety of mounting configurations. The thermal resistance of the heat sink is kept low by the presence of the fan which helps create an airflow to help draw heat away from the source.

In order to maximize the effectiveness of the ATS-17H-12-C1-R0, it is important that the heat source and the aluminum body have the appropriate thermal contact. The copper base of the heat sink should be in direct contact with the heat source for optimal performance. It is also important to ensure that the fan is properly placed to maximize the airflow and allow for maximum air circulation. Proper mounting of the heat sink is an important factor in ensuring optimal cooling and thermal performance.

Conclusion

The ATS-17H-12-C1-R0 is a cost effective, high performance thermal management device designed to meet the needs of a wide variety of applications. This heat sink features a stainless steel body with a copper base for optimal thermal operation. The large base area ensures maximum conductivity while still providing a low profile for a variety of mounting configurations. The heat sink includes an airflow baffle which ensures the best possible thermal performance and a high efficiency fan to provide superior cooling for high power components. This heat sink is ideal for use in a wide variety of applications, such as medical, industrial, automotive, and consumer electronics.

The specific data is subject to PDF, and the above content is for reference

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