| Allicdata Part #: | ATS29415-ND |
| Manufacturer Part#: |
ATS-17H-131-C2-R0 |
| Price: | $ 5.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X20MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17H-131-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 5.05260 |
| 10 +: | $ 4.91589 |
| 25 +: | $ 4.64285 |
| 50 +: | $ 4.36968 |
| 100 +: | $ 4.09658 |
| 250 +: | $ 3.82347 |
| 500 +: | $ 3.55036 |
| 1000 +: | $ 3.48209 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.60°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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A thermal – heat sink (aka heat spreader, heat exchanger, heat-conductive substrate, heat cone, etc.) is an essential component of all electronic systems. A good thermal – heat sink is vital to maintaining the reliability of the system and thus providing reliable performance over its lifetime. The ATS-17H-131-C2-R0 is an advanced, cost effective solution, designed to meet high demands within the field of thermal – heat sinks.
ATS-17H-131-C2-R0 Application Field and Working Principle
The ATS-17H-131-C2-R0 thermal – heat sink is designed for applications where maximum thermal performance and dissipation is essential. This advanced solution is optimized for use in high-temperature applications, including micro-electronic and thermoelectric cooling. The ATS-17H-131-C2-R0 offers superior thermal performance and a range of features that enable electronic systems to operate reliably under extreme thermal conditions.
The ATS-17H-131-C2-R0 thermal – heat sink is based on the revolutionary body constructed of highly thermally conductive material. This material has an extremely efficient heat transfer coefficient that ensures maximum thermal performance and dissipation. The interior PCB is equipped with optimizing vents that maximize the airflow whilst dissipating heat evenly and efficiently. The intricate surface of the heat spreader ensures that temperatures are distributed evenly across the surface area, ensuring maximum performance.
The ATS-17H-131-C2-R0 thermal – heat sink also includes an innovative integrated fan mount, allowing for optimal air circulation. This fan mount is specifically designed to reduce vibration and electromagnetic interference, enabling it to operate at higher vibration levels than standard heatsinks. The fan mount also ensures decreased noise when in operation, as well as increased cooling rates over standard cooling solutions.
The ATS-17H-131-C2-R0 thermal – heat sink offers a low thermal resistance interface that works together with the optimally constructed substrate material to further maximize thermal performance and dissipations. When coupled with a correctly designed fan, it can achieve thermal dissipation rates up to 3x greater than those of standard cooling solutions.
The ATS-17H-131-C2-R0 thermal – heat sink is highly efficient, well-engineered solution to thermal control. This advanced solution is designed for use in the most demanding environments, delivering reliable, consistent thermal performance over its lifetime.
The specific data is subject to PDF, and the above content is for reference