ATS-17H-17-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.126" (54.01mm)
Width:	2.126" (54.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.500" (12.70mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	15.44°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction:

Thermal - Heat Sinks are components that help transfer heat away from electronic components. Heat sinks are available in a wide variety of designs, shapes, and sizes tailored to application requirements. This article focuses on the specifics of the ATS-17H-17-C2-R0 design and its associated applications and working principles.

Design of ATS-17H-17-C2-R0:

The ATS-17H-17-C2-R0 is a copper-based heat sink with a thermal resistance value of 0.10 °C/W. It has a large, flat radiating surface area made of 17 fins for maximum heat dissipation. The design also includes two layers of aluminum fins separated by copper base. This helps maximize the thermal performance by allowing for more air circulation. The ATS-17H-17-C2-R0 is designed to fit into a 1/2" height.

Application Field of ATS-17H-17-C2-R0:

The ATS-17H-17-C2-R0 is designed primarily for industrial and electronic applications, such as in the telecommunications, medical, automation, and military/aerospace industries. The ATS-17H-17-C2-R0 is used in devices requiring small size and low-cost construction, such as handheld and embedded systems. This heat sink can also be used for moderately-powered LED lighting, spas, PCs, and other applications requiring quick heat dissipation and cooling.

Working Principles of ATS-17H-17-C2-R0:

Heat is dissipated by transferring it away from components and into the environment. Heat sinks increase the rate at which this transfer of heat can occur, thereby allowing components to operate at cooler temperatures. Natural convection is used in the ATS-17H-17-C2-R0 because its extended surface area allows more air to pass over the fins, allowing heat to be dissipated more quickly. The multiple layers of fins and copper base in this design help maximize its air circulation without increasing the overall size, thus improving the heat transfer rate.

Conclusion:

The ATS-17H-17-C2-R0 heat sink is an optimized design for use in many industrial and electronic applications. Its low cost and small size make it suitable for use in handheld and embedded systems. Its design of 17 fins and the copper base help increase the surface area and improve the rate of heat transfer. Its thermal resistance of 0.10°C/W ensures that it can adequately dissipate heat away from components and into the environment.

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