| Allicdata Part #: | ATS-17H-189-C3-R0-ND |
| Manufacturer Part#: |
ATS-17H-189-C3-R0 |
| Price: | $ 4.41 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X20MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17H-189-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.96711 |
| 30 +: | $ 3.74703 |
| 50 +: | $ 3.52661 |
| 100 +: | $ 3.30618 |
| 250 +: | $ 3.08577 |
| 500 +: | $ 2.86535 |
| 1000 +: | $ 2.81025 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.82°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Introduction
The ATS-17H-189-C3-R0 is a thermal heat sink product line developed by Tactical Aerospace Systems (TAS). It is an innovative product designed to address the cooling needs of electronic components in a variety of applications.
Application Field
The ATS-17H-189-C3-R0 heat sink is used primarily for dissipating heat generated by electronic components. It is specifically designed for high-end consumer electronics and industrial electronics. It can also be used to cool a variety of specialty items, such as radio, storage, graphic cards, CPU\'s, and medical devices.
The ATS-17H-189-C3-R0 heat sink is a great choice for applications with varying thermal needs, such as gaming systems and high-end servers. It is also well-suited to automotive electronics, medical electronics, and consumer electronics. Additionally, its ability to quickly dissipate heat makes the ATS-17H-189-C3-R0 heat sink a great choice for applications that require extreme temperature control, such as laser equipment, high-end computer networking, and laboratory components.
Working Principle
The ATS-17H-189-C3-R0 utilizes a patented design to rapidly transfer thermal energy away from the device surface. It uses a “pin” finned configuration to maximize the heat transfer surface area, and thus increase the ability to dissipate heat. The heat sink consists of a thermally conductive material, such as aluminum or copper, and has a thermal resistance value of 0.02°C/W or better.
The aluminum ATS-17H-189-C3-R0 heat sink is cut to a specified size and then is shaped to increase the air flow throughout the heat sink. This “pin” finned design reduces the overall thermal resistance, and is highly efficient in dissipating heat from the electronic components and eliminating hot spots. The thermal resistance can also be further reduced by adding cooling fins or a special coating to the surface of the heat sink.
The ATS-17H-189-C3-R0 thermal heat sink is designed to be efficient in both active and passive cooling applications. In active cooling, the heat sink is cooled by some form of external cooling, such as a fan, while in passive cooling, the heat sink relies solely on the ambient airflow in the environment. Active cooling is typically more efficient than passive cooling, however, the ATS-17H-189-C3-R0 heat sink is designed to be effective in both scenarios.
Conclusion
The ATS-17H-189-C3-R0 thermal heat sink is a highly efficient product designed to address the cooling needs of electronic components. It utilizes a patented design to rapidly transfer thermal energy away from the device surface, and is well-suited to a variety of application fields. Its ability to quickly dissipate heat make the ATS-17H-189-C3-R0 heat sink an ideal choice for applications that require extreme temperature control.
The specific data is subject to PDF, and the above content is for reference