| Allicdata Part #: | ATS-17H-197-C3-R0-ND |
| Manufacturer Part#: |
ATS-17H-197-C3-R0 |
| Price: | $ 3.51 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17H-197-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.18591 |
| 30 +: | $ 3.09981 |
| 50 +: | $ 2.92774 |
| 100 +: | $ 2.75549 |
| 250 +: | $ 2.58325 |
| 500 +: | $ 2.49714 |
| 1000 +: | $ 2.23882 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.05°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-17H-197-C3-R0 variant of thermal - heat sinks are designed to provide a high performance, energy efficient and cost-effective solution for managing electronic component temperatures for a wide range of applications. This product range is constructed with a series of forged aluminum fins helping to dissipate heat effectively and quickly.
These heat sinks are designed to effectively transfer heat away from any hot components such as processors, graphic cards, memory modules, and other high-power components. The fins are specially angled in order to maximize surface area contact with the surrounding air allowing for heat to dissipate quicker. They also come equipped with a combination of trademarked HDT, HDC and HDH technology which enhances the thermal performance of the product further.
The ATS-17H-197-C3-R0 model heat sinks can be installed directly onto any compatible electronic component using the supplied thermal paste and mounting hardware. With the provided screws and mounting clips, it is possible to secure the heat sink to either a printed circuit board or any surface. For optimal cooling performance, airflow from case fans should be directed at the heat sink.
Heat sinks are highly effective for dissipating heat at low to moderately high power levels. In the case of the ATS-17H-197-C3-R0, it is best used with components that have no more than a 60 watt load. It can also be used for cooling low power chips and components, such as microcontrollers, where the thermal performance requirements are not as strict.
As far as construction is concerned, the ATS-17H-197-C3-R0 is constructed with a combination of forged aluminum fins, copper core, and patented HDT, HDC and HDH technologies for maximum thermal performance and reliable contact with the heat source. This makes it a great option for applications that require reliable and durable cooling solutions.
In order to maximize the performance of the ATS-17H-197-C3-R0, it is important to ensure that it is correctly installed and that the airflow to the heat sink is optimal. Additionally, the use of a good quality thermal paste is essential for proper heat dissipation.
The ATS-17H-197-C3-R0 series of thermal - heat sinks are a great option for applications that require reliable and cost-effective cooling solutions. With its patented HDT, HDC and HDH technologies, this product range is capable of dissipating heat effectively and quickly, while ensuring that temperatures of electronic components are kept within safe limits.
The specific data is subject to PDF, and the above content is for reference