| Allicdata Part #: | ATS-17H-47-C1-R0-ND |
| Manufacturer Part#: |
ATS-17H-47-C1-R0 |
| Price: | $ 3.65 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X30MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17H-47-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.31695 |
| 30 +: | $ 3.22707 |
| 50 +: | $ 3.04781 |
| 100 +: | $ 2.86858 |
| 250 +: | $ 2.68930 |
| 500 +: | $ 2.59965 |
| 1000 +: | $ 2.33071 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.24°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-17H-47-C1-R0
The ATS-17H-47-C1-R0 is a thermal heat sink designed to dissipate excessive heat when used in an electronic device. It is an aluminum heat sink, and offers a great amount of thermal conduction, making it ideal for application in a wide variety of machines and devices. It has an average thermal resistance of 17°C/W, and a current rating of up to 4.7A.
Applications
The ATS-17H-47-C1-R0 is designed for dissipating the heat that is generated during the operation of various electronic devices. It has a wide range of applications, including providing additional cooling for processors, or providing supplemental cooling for over-clocked systems and integrated circuits. The ATS-17H-47-C1-R0 can also be used in many other projects and applications that require extra thermal cooling.
Working Principle
The ATS-17H-47-C1-R0 operates on a principle of thermal conduction. Whenever heat is generated in an electronic device, the heat gets absorbed by the thermal heat sink, which then dissipates the heat away from the device. This is done by allowing the thermal heat sink to contact the heat sink\'s cooling fins. The cooling fins are usually made of wood or metal, and help dissipate the heat away from the device. The more contact that can be made between the thermal heat sink and the fins, the more efficient the heat transfer will be.
The thermal heat sink is also designed to evenly distribute heat throughout the device. This allows for better cooling efficiency, because it ensures that the heat generated is more evenly dissipated, rather than concentrated in a single area, which can cause overheating and other issues.
Conclusion
The ATS-17H-47-C1-R0 thermal heat sink is a reliable and efficient way of dissipating excess heat from an electronic device. It offers great thermal conduction and an average thermal resistance of 17°C/W. Its wide range of applications make it suitable for many projects, from industry to hobbyist. It is capable of evenly distributing heat, ensuring that any areas that tend to become hotter than others are kept cool. The ATS-17H-47-C1-R0 is a great choice for any project or application where additional cooling is required.
The specific data is subject to PDF, and the above content is for reference