
Allicdata Part #: | ATS-17H-72-C1-R0-ND |
Manufacturer Part#: |
ATS-17H-72-C1-R0 |
Price: | $ 4.43 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 45X45X35MM L-TAB |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 3.99042 |
30 +: | $ 3.76887 |
50 +: | $ 3.54715 |
100 +: | $ 3.32545 |
250 +: | $ 3.10376 |
500 +: | $ 2.88206 |
1000 +: | $ 2.82664 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.772" (45.00mm) |
Width: | 1.772" (45.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 1.378" (35.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 5.09°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-17H-72-C1-R0 thermal heat sink is designed for high-end applications that require efficient heat management and minimized noise production. This unit is the perfect option for situations where space is of a premium and noise is an issue. With its superior capacity for heat transfer and low noise production, the ATS-17H-72-C1-R0 thermal heat sink is the ideal choice for a wide range of high-end applications.
The primary purpose of thermal heat sinks is to provide an effective and efficient way of conducting heat away from sensitive components. In the case of the ATS-17H-72-C1-R0, this is achieved through its optimized fin design, which allows it to maximize heat exchange while minimizing noise. The unit consists of an aluminum base featuring a high-density fin array with an efficient transfer and distribution system. The fin array also features an extended surface area with optimized geometry in order to further aid in heat transfer.
In terms of its applications, the ATS-17H-72-C1-R0 thermal heat sink is suitable for use in a variety of high-end processing applications. These include applications in industries such as biomedical electronics, telecommunications, industrial equipment, etc., where it can be used to provide an effective cooling solution while minimizing noise. Additionally, it is a perfect choice for applications where size and weight constraints are an issue, such as in high-end laptop computers.
The working principle behind the ATS-17H-72-C1-R0 thermal heat sink is based on the fact that heat is transferred from hot objects to cooler ones. The cooler air passing through the fin array picks up the heat from the heat sink and takes it away from the device. The fin array itself is designed to maximize the surface area while simultaneously minimizing turbulence and maximizing the amount of heat exchanged. This, in turn, ensures that the heat is transferred from the heat sink to the ambient air quickly and efficiently, thus allowing the heat sink to do its job of cooling the device.
Although heat is the main concern when it comes to thermal heat sinks, noise production can also become an issue depending on the application. Fortunately, the ATS-17H-72-C1-R0 thermal heat sink features an advanced fan design which ensures low noise production. This makes it an ideal choice for applications in which loud fans can become a nuisance. Furthermore, the unit features optimized vibration damping and noise reduction technologies, which further contribute to its low-noise operation.
Overall, the ATS-17H-72-C1-R0 thermal heat sink is the perfect choice for applications that require efficient heat management and minimized noise production. With its superior capacity for heat transfer, low noise production, and optimized design, this unit is a reliable and effective option for a wide range of high-end applications.
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