| Allicdata Part #: | ATS29590-ND |
| Manufacturer Part#: |
ATS-18A-110-C2-R1 |
| Price: | $ 5.59 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X40X12.7MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18A-110-C2-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 5.07780 |
| 10 +: | $ 4.93920 |
| 25 +: | $ 4.66452 |
| 50 +: | $ 4.39022 |
| 100 +: | $ 4.11585 |
| 250 +: | $ 3.84146 |
| 500 +: | $ 3.56707 |
| 1000 +: | $ 3.49848 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 26.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a crucial element of any system design, and proper heat-sinking solutions must be implemented for system robustness. ATS-18A-110-C2-R1 is one such efficient solution designed to improve the stability of electronic devices through effective control of heat and power dissipation.
ATS-18A-110-C2-R1 is a variety of heat sinks, typically used in industrial, military, automotive and medical applications. It boasts a large area of aluminum fins which makes it suitable for dissipating large amount of heat. The thermal conductivity of the aluminum fins helps dissipate the heat away from the electronic device quickly and efficiently. Apart from that, the C2-R1 has a compact design and an anodized finish which not only increases its durability, but also enhances its corrosion resistance.
The working principle of the ATS-18A-110-C2-R1 is fairly simple. It consists of an array of individual fins mounted on a common base plate. The fins form a heat-sink to dissipate the heat away from the electronics component, while the base plate helps to secure the device within the application. The working surface of the fins captures the heat generated by the device and transfers it to the surrounding atmosphere, where it is dissipated.
The ATS-18A-110-C2-R1 can be used in almost any environment thanks to its excellent performance even under extreme temperatures. It is perfect for applications such as cooling high-temperature components, like processors, graphics cards and power transistors. As such, these heat sinks are ideal for a wide range of specialized electronic applications that require durable and efficient thermal management.
In addition, the ATS-18A-110-C2-R1 can be fitted with several supporting components, such as a fan assembly, to provide additional cooling capacity and to ensure more efficient heat dissipation. This makes the heat sink ideal for applications that require reliable cooling performance and high temperature stability, such as in military, automotive, and medical systems.
Overall, the ATS-18A-110-C2-R1 is a reliable thermal management solution designed to improve the stability of electronic devices while dissipating large amounts of heat efficiently. Its large aluminum fins make it suitable for any kind of application and its versatility makes it a perfect choice for a wide range of specialized uses.
The specific data is subject to PDF, and the above content is for reference