| Allicdata Part #: | ATS29625-ND |
| Manufacturer Part#: |
ATS-18A-142-C2-R0 |
| Price: | $ 3.84 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18A-142-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.49020 |
| 10 +: | $ 3.40011 |
| 25 +: | $ 3.30800 |
| 50 +: | $ 3.12430 |
| 100 +: | $ 2.94052 |
| 250 +: | $ 2.75675 |
| 500 +: | $ 2.66487 |
| 1000 +: | $ 2.38918 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.07°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is extremely important for any type of electronic device. Without proper cooling, components in a system can become overheated and sustain damage. To eliminate this problem, manufacturers use components such as heat sinks to disperse heat away from the components and help keep them from overheating. One of the most common heat sink components is the ATS-18A-142-C2-R0, which offers great performance and reliability.
The ATS-18A-142-C2-R0 is a type of Heat Sink that is designed to dissipate heat from the components it is attached to. It is a combination of an aluminum heat sink and a copper core that is bonded together with a high thermal conductive epoxy. This epoxy forms a rigid bond between the two components, which eliminates the need for additional fastening hardware. This also ensures that the ATS-18A-142-C2-R0 is securely attached to the components and helps to ensure efficient heat transfer. This heat sink is also designed with a highly efficient thermal profile that helps it quickly and effectively transfer heat away from circuitry.
Due to the design of the ATS-18A-142-C2-R0, it can be used in a wide range of applications. This includes applications such as power supplies, high power transistors, high frequency amplifiers, and more. It provides excellent performance and is able to dissipate high levels of heat, making it suitable for a number of different applications. It is also designed to look attractive and discreet, making it fit into any space or application.
The ATS-18A-142-C2-R0 has a few key advantages that make it a great choice for any application. One of the most important features is its thermal properties that enable it to dissipate heat quickly and efficiently. Additionally, the epoxy used to bond the copper core and aluminum heat sink together adds strength and reliability to the material, ensuring that it will stay secure in any application. Finally, the discreet design of the ATS-18A-142-C2-R0 makes it suitable for any space, minimizing the amount of visible hardware in the system.
The working principle of the ATS-18A-142-C2-R0 is quite simple. Heat is generated by the components in a system and the heat sink helps to disperse this heat away from the components. The epoxy between the copper core and aluminum heat sink transfers the heat into the heat sink, where it is dissipated out into the environment. This helps to keep components from becoming too hot and helps keep the system running efficiently and smoothly.
The ATS-18A-142-C2-R0 offers great thermal properties combined with reliable performance and attractive design, making it a great choice for any application. Its combination of features and benefits make it the perfect solution for both commercial and consumer electronic systems. It offers both durability and performance, making it a great choice for any thermal management solution.
The specific data is subject to PDF, and the above content is for reference