ATS-18A-15-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-18A-15-C1-R0-ND

Manufacturer Part#:

ATS-18A-15-C1-R0

Price: $ 3.85
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 50X50X25MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-18A-15-C1-R0 datasheetATS-18A-15-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.49524
30 +: $ 3.40074
50 +: $ 3.21174
100 +: $ 3.02280
250 +: $ 2.83387
500 +: $ 2.73940
1000 +: $ 2.45602
Stock 1000Can Ship Immediately
$ 3.85
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.969" (50.00mm)
Width: 1.969" (50.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.42°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-18A-15-C1-R0 is a thermal heat sink from Advanced Thermal Solutions. A heat sink dissipates heat from components, such as CPUs, chipsets, and memory, which all produce heat during operation. The main purpose of this heat sink is to lower the temperature of the components it is attached to. This lowers the risk of thermal damage and helps keep the system stable.

The ATS-18A-15-C1-R0 is specifically designed for applications which require a cooling capacity of 18 watts and dimensions of approximately 15.15 mm x 15.15 mm. It is made out of Aluminum 6063-T5 and comes with an anodized black finish. It has a thermal resistance of R0.33°C/watt in ideal ambient conditions.

In order to install the ATS-18A-15-C1-R0, it needs to be attached to the component that it is cooling. This can usually be done by using thermal paste and metal clips that come with the heat sink. The heat sink also needs to be connected to a power source, often a fan, in order to draw in cooler air and push out the hot air. The installation process varies depending on the component it is being attached to.

Once the ATS-18A-15-C1-R0 is installed, it begins to work by dissipating the heat that is produced by the components. This is done by using a combination of convection, radiation, and conduction, which all help to move the heat away from the component and into the atmosphere. The heat sink works by increasing the surface area, which helps to increase the rate of heat transfer. This helps the components to stay at a safe temperature, ensuring their longevity.

The ATS-18A-15-C1-R0 is designed for applications that require the cooling of components such as CPUs, chipsets, memory, and other electronic components. It is an efficient way to dissipate heat in order to keep components running at their optimum levels and extend their lifespan. This heat sink is a great choice for systems that need to dissipate 18 watts of heat without sacrificing size or performance.

The specific data is subject to PDF, and the above content is for reference

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