| Allicdata Part #: | ATS29653-ND |
| Manufacturer Part#: |
ATS-18A-168-C2-R0 |
| Price: | $ 3.52 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X25MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18A-168-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.20040 |
| 10 +: | $ 3.11472 |
| 25 +: | $ 3.03055 |
| 50 +: | $ 2.86209 |
| 100 +: | $ 2.69375 |
| 250 +: | $ 2.52542 |
| 500 +: | $ 2.44124 |
| 1000 +: | $ 2.18870 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.01°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is essential for electronics, and thermal performance is key to keeping components running at their best. The ATS-18A-168-C2-R0 is a heat sink designed for use in various applications. It features anodized aluminum extrusion, a finned heat sink base and a fan with an adjustable speed and temperature control.
Heat sinks are designed to absorb and dissipate heat away from a device or component. The ATS-18A-168-C2-R0 is an efficient heat sink with a large fin area providing ample surface area. Its extrusion design is designed for use with standard metric screw thread and its base is optimized for optimal performance.
The ATS-18A-168-C2-R0 also features a fan with adjustable speed and temperature control. The fan has continuous speed control and is adjustable over a wide range, allowing for precise temperature control. The fan also runs at a low noise level, making it an ideal choice for noise sensitive applications.
The ATS-18A-168-C2-R0 is designed for a variety of applications. It is an ideal solution for: server and storage components, I/O cards, power boards, telecommunications systems, networking equipment, industrial equipment, medical electronics, and consumer electronics. Its high performance design is suitable for applications that require reliable and efficient operation.
The ATS-18A-168-C2-R0 is designed to work in conjunction with other cooling devices such as fans and other cooling products. By utilizing these devices, it is possible to further enhance the performance of a system by reducing total system power and improving reliability. The ATS-18A-168-C2-R0 also works well in applications where ambient air temperature is greater than the temperature of the electronic device.
The working principle of the ATS-18A-168-C2-R0 heat sink is based on conduction. Heat is conducted away from a device or component and dissipated by the surrounding fins. As air passes through the fins, heat is carried away from the device and is expelled into the atmosphere by the fan. Generally, the higher the heat sink\'s surface area, the greater its effect on the heat dissipation.
The ATS-18A-168-C2-R0 heat sink provides superior thermal management and performance. By combining efficient thermal dissipation, continuous temperature control and low noise operation, it makes an ideal choice for a wide range of applications. Its anodized aluminum extrusion, finned design, adjustable fan speed and temperature control make it an optimal solution for reliable and efficient cooling.
The specific data is subject to PDF, and the above content is for reference