ATS-18A-195-C1-R0 Fans, Thermal Management

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.472" (12.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	10.88°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal - Heat Sinks are devices used to dissipate heat from electrical components. Among many types of heatsinks, ATS-18A-195-C1-R0 is one of the most popular and widely used in various electronic circuits or systems. In this article, we will discuss the application field and working principle of ATS-18A-195-C1-R0.

Applications of ATS-18A-195-C1-R0

ATS-18A-195-C1-R0 is an advanced thermal management solution, used for dissipating heat from components such as LEDs, power transistors, and microprocessors as well. It features low cost and require low installation space, thus making it suitable for applications with tight space restriction. Heat generated from electrical components can degrade their performance, and cause permanent damage if not properly dissipated. This makes ATS-18A-195-C1-R0 an important and necessary component for many electronic circuits and systems.

Working Principle of ATS-18A-195-C1-R0

ATS-18A-195-C1-R0 uses the principle of natural convection to dissipate the heat from electrical components. The device has an outer rim with a set of louvers that angle towards the surface of the component. As air passes through the louvers, the surface of the component is heated, and the warm air rises up and is displaced by cooler air, thus creating a convection cycle. This process helps to transfer heat away from the component, and into a surrounding coolant such as air or water.In some applications, adding a fan to the heatsink will help to further accelerate the natural convective cooling process. The fan forces air over the heat sink fins, helping to further dissipate the heat faster. In addition, heat can also be dissipated by using multiple heatsinks connected together, allowing for greater surface area for heat transfer.

Conclusion

ATS-18A-195-C1-R0 is a thermal management solution used to dissipate heat from electrical components, and is popularly used in many electronic circuits and systems. It utilizes the principle of natural convection to transfer heat away from the component, and a fan can be used to accelerate the process. This device is relatively low cost and requires low installation space, and can be connected together in multiple units for greater thermal dissipation.

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