ATS-18A-20-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.126" (54.01mm)
Width:	2.126" (54.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.13°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to ATS-18A-20-C1-R0 Thermal - Heat Sinks

Thermal - Heat Sinks are components used in many electronics applications to dissipate heat. The ATS-18A-20-C1-R0 is one such type of Heat Sink. It is a compact, high performance heat sink specifically designed to meet the heat-dissipation requirements of a wide variety of electronic components.

Applications of ATS-18A-20-C1-R0 Thermal - Heat Sinks

The ATS-18A-20-C1-R0 has a wide range of applications. It is an ideal choice for a number of highly sensitive electronic components, including voltage regulator modules (VRMs), power transistors, ICs, and electronic control units (ECUs). Additionally, the ATS-18A-20-C1-R0 is used to meet the thermal requirements of passive components such as resistors, capacitors, and inductors. The ATS-18A-20-C1-R0 is particularly suited for applications in the automotive, telecommunications, aerospace, and medical industries where higher-power components and devices are used. The compact size of the ATS-18A-20-C1-R0 allows it to fit easily into tight spaces, and its lightweight construction makes it ideal for applications where space is a premium.

Design of ATS-18A-20-C1-R0 Thermal - Heat Sinks

The ATS-18A-20-C1-R0 is designed to maximize the rate of heat transfer from an electronic component to its environment. It is constructed out of a single aluminum extrusion that has been precisely engineered to provide a high level of cooling efficiency. The extrusion is finished with an anodized black coating that provides corrosion resistance and improved heat dissipation. The ATS-18A-20-C1-R0 has an optimized fin configuration that provides a large surface area for heat dissipation. The fins are spread out over the length of the heastsink, and close spacing between the fins allows for maximum heat dissipation. Additionally, the fins are machined to a precisely calculated profile for optimal performance. The ATS-18A-20-C1-R0 also features an integrated mounting system for easy installation on circuit boards. The mounting system helps ensure secure and reliable connections between the heat sink and the electronic component, and is designed to be compatible with most standard circuit board mounting schemes.

Working Principle of ATS-18A-20-C1-R0 Thermal - Heat Sinks

The ATS-18A-20-C1-R0 is designed to dissipate heat away from the electronic components to which it is attached. Heat generated by the component is absorbed by the heat sink, and then dissipated to its environment through convection and radiation. Heatsink fins provide an increased surface area for heat transfer, and by increasing the temperature gradient between the heatsink and its environment, heat is conducted away from the component more efficiently. The integrated mounting system is designed to ensure the heat sink is efficiently connected to the electronic component. The mounting system helps ensure the heat generated by the component transfers directly to the heat sink, rather than being lost to the environment via air convection. Additionally, the mounting system is designed to provide secure, long-lasting attachment to the circuit board, ensuring reliable and consistent performance.

Conclusion

In conclusion, the ATS-18A-20-C1-R0 is a high performance, compact heat sink designed specifically for a wide range of electronic components. It features an optimized fin design with an anodized black coating for improved heat transfer and corrosion resistance, and an integrated mounting system for secure and reliable attachment to the circuit board. The ATS-18A-20-C1-R0 is well suited for a variety of highly sensitive applications in the automotive, telecommunications, aerospace, and medical industries.

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