| Allicdata Part #: | ATS-18A-200-C3-R0-ND |
| Manufacturer Part#: |
ATS-18A-200-C3-R0 |
| Price: | $ 3.81 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18A-200-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.45933 |
| 30 +: | $ 3.36588 |
| 50 +: | $ 3.17898 |
| 100 +: | $ 2.99193 |
| 250 +: | $ 2.80496 |
| 500 +: | $ 2.71146 |
| 1000 +: | $ 2.43095 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.90°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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:Thermal-Heat Sinks are a class of devices that are used to dissipate heat from electronic components and assemblies.
ATS-18A-200-C3-R0 is a type of thermal-heat sink designed to dissipate heat from components such as processors, voltage regulators, transistors, and other components that generate heat. It is made of aluminum, which is a good conductor of heat, and consists of a base and fins. The base is made from a single block of aluminum and has channels machined in it that allow air to flow through and take away the heat dissipated by the components. The fins are created by extruding aluminum into small strips, which are then attached to the base of the device.
The working principle of the ATS-18A-200-C3-R0 is based on the process of convection. Heat generated by the components passes into the aluminum base, which acts as a heat sink. The base then absorbs this heat and conducts it away to the fins. As air passes over the fins, it absorbs the heat, which is then taken away by the airflow generated by the device. As air is exhausted out of the device, the heat is carried away with it, allowing the components to remain cooler.
The ATS-18A-200-C3-R0 is well-suited for a variety of applications, such as desktop computers, high-performance servers, military systems, and even automotive applications. The device is capable of dissipating large amounts of heat, making it ideal for environments where heat is an issue. Additionally, the device is designed to be corrosion and shock resistant, making it suitable for use in harsh environments.
The ATS-18A-200-C3-R0 is a highly effective and reliable thermal-heat sink that is designed to provide effective heat dissipation and cooling efficiency. Its robust design makes it well-suited for a variety of applications, and its robust construction makes it well-suited for use in harsh environments. As such, it is an ideal choice for those in need of an effective and reliable way to dissipate heat from their components and assemblies.
The specific data is subject to PDF, and the above content is for reference