| Allicdata Part #: | ATS-18A-37-C1-R0-ND |
| Manufacturer Part#: |
ATS-18A-37-C1-R0 |
| Price: | $ 5.43 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 36.83X57.6X17.78MM |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-18A-37-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.88124 |
| 30 +: | $ 4.60992 |
| 50 +: | $ 4.33881 |
| 100 +: | $ 4.06766 |
| 250 +: | $ 3.79648 |
| 500 +: | $ 3.52531 |
| 1000 +: | $ 3.45751 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.450" (36.83mm) |
| Width: | 2.267" (57.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.700" (17.78mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.10°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-heat sinks are very important for electronic devices. They are designed to absorb the heat and dissipate it in a thermal-conducting medium, such as air, water, or other liquids. In thermal engineering, they are used to transfer heat away from an electronic component, such as a transistor, diode, or an integrated circuit.
The ATS-18A-37-C1-R0 is a thermal-heat sink intended to dissipate heat away from an electronic device. This type of thermal-heat sink is characterized by its size and shape. This type is usually rectangular in shape, and measures 18 by 37 inches. The surface finish is generally anodized, and the profile is extruded. The slotted fins on the sink provide additional surface area to dissipate heat quicker.
The primary purpose for a heat sink is to dissipate the heat away from the component. Heat sinks are usually made of aluminum, which is highly thermally conductive. The heat that is directed away from the electronic component can be dissipated quickly, thus making the component more efficient.
The working principle of the ATS-18A-37-C1-R0 is the same as other conventional heat sinks. The device works by dissipating heat away from an electronic component via thermal conduction. Heat is transferred through the material of the heat sink into a thermal-conducting medium, such as air or liquid. The heat will then spread out in the surrounding environment, and not accumulate around the component. The fins on the sink provide additional surface area that helps the heat dissipate faster.
The ATS-18A-37-C1-R0 has many applications. It is commonly used to cool down industrial and automotive electronics. It is also used in computers, telecommunications equipment, and other consumer electronics. The heat sink can also be used in applications where there is a need to dissipate a large amount of heat quickly. This would include laser diodes, LEDs, and other light emitting devices.
In conclusion, the ATS-18A-37-C1-R0 is a thermal-heat sink designed to dissipate heat away from an electronic component. Its rectangular design and slotted fins provide additional surface area for faster heat dissipation. The heat sink is versatile, and can be used for cooling down industrial and automotive electronics as well as computers, telecommunications equipment, and other consumer electronics.
The specific data is subject to PDF, and the above content is for reference
ATS-18A-37-C1-R0 Datasheet/PDF