ATS-18A-43-C1-R0 Fans, Thermal Management |
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| Allicdata Part #: | ATS-18A-43-C1-R0-ND |
| Manufacturer Part#: |
ATS-18A-43-C1-R0 |
| Price: | $ 3.13 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X10MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18A-43-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.81736 |
| 30 +: | $ 2.74134 |
| 50 +: | $ 2.58905 |
| 100 +: | $ 2.43671 |
| 250 +: | $ 2.28446 |
| 500 +: | $ 2.20830 |
| 1000 +: | $ 1.97985 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 28.78°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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A thermal-heat sink is used to efficiently disperse and dissipate heat generated by an electronic device. The ATS-18A-43-C1-R0 is a high-performance, compact, low-profile, high-efficiency thermal-heat sink designed to provide efficient thermal management for high output power consuming devices. The ATS-18A-43-C1-R0 thermal-heat sink consists of two core components: a base and a fin array. The fin array is designed to provide a large surface area to effectively dissipate heat generated by the device, while the base provides a rigid mounting surface for the fin array.
The efficiency of the thermal-heat sink is determined by two main characteristics: dissipation efficiency and thermal resistance. Dissipation efficiency is a measure of how much heat energy can be dissipated from the device. Thermal resistance is the measure of how well the thermal-heat sink can dissipate the heat energy away from the device. The ATS-18A-43-C1-R0 thermal-heat sink has a high dissipation efficiency of 95%, and a low thermal resistance of 0.53 Kelvin/watt. This makes the ATS-18A-43-C1-R0 an ideal choice for applications that require efficient thermal management.
The ATS-18A-43-C1-R0 thermal-heat sink is designed for use in a wide variety of electronic devices including industrial and automation components, medical equipment, automotive electronics, telecommunications, high-power LEDs and other peripherals. The ATS-18A-43-C1-R0 can be used in applications with temperatures up to 85°C and is compatible with all standard mounting systems. The thermal-heat sink is easy to install and requires no additional tooling or adjustment to maintain its optimal operation.
The working principle of the ATS-18A-43-C1-R0 thermal-heat sink is based on the concept of thermoelectric cooling. When a temperature difference is present between two objects of different thermal conductivities, heat will naturally flow from the warmer object to the colder object. The ATS-18A-43-C1-R0 uses aluminum fins and copper plates to draw heat away from an electronic device, creating a cooler environment for the device. As the heat is drawn away from the device, the airflow around the fins increases the rate of cooling. This effectively dissipates the heat, providing a steady and reliable cooling efficiency.
The ATS-18A-43-C1-R0 thermal-heat sink is an ideal choice for any application that requires effective thermal management. Its compact size and lightweight design make it easy to install and maintain, and its efficient cooling performance makes it a cost-effective solution. With its high dissipation efficiency and low thermal resistance, the ATS-18A-43-C1-R0 is the perfect choice for any application that requires reliable thermal management.
The specific data is subject to PDF, and the above content is for reference