| Allicdata Part #: | ATS-18A-70-C1-R0-ND |
| Manufacturer Part#: |
ATS-18A-70-C1-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18A-70-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.57399 |
| 30 +: | $ 3.37554 |
| 50 +: | $ 3.17696 |
| 100 +: | $ 2.97845 |
| 250 +: | $ 2.77989 |
| 500 +: | $ 2.58133 |
| 1000 +: | $ 2.53168 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.69°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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A heat sink is a device designed to absorb and dissipate heat from an object or area. In this case, the ATS-18A-70-C1-R0 heat sink is designed for use in many different situations, including cooling electronic components, processors, and other high-power utilization items.
The ATS-18A-70-C1-R0 is ideal for applications requiring an extremely efficient solution to heat dissipation. This heat sink is designed with a variety of intricate features, including a unique AirTech™ heat spreader, and a patented Y-shaped base for optimal thermal management. With an expansive aluminum fin surface area combined with significantly increased thermal mass, this heat sink is capable of providing an extensive range of thermal solutions for any type of application.
The patented Y-shaped base design architecture gives this heat sink maximum heat dissipation performance. This design also allows its construction with multiple cooling fins that are angled for higher efficiency air flow over its heat sink surface area.
The AirTech™ technology incorporated into the ATS-18A-70-C1-R0 heat sink greatly improves its thermal efficiency by providing an air gap between the cooling fins and the heat generated components. This gap acts as a thermal boundary layer, where temperatures are kept lower than that of the component due to the air flow passing through the gap.
Despite its relatively small size, the ATS-18A-70-C1-R0 heat sink is capable of dissipating more than 580W of heat from any application. This makes it ideal for cooling very high power applications such as high-performance computing, 3D printing, and other high-performance applications.
The ATS-18A-70-C1-R0 heat sink is highly adjustable, allowing users to mount it on most components with very few modifications. It can be used with a variety of fans and air coolers, and its versatile design makes it easy to install in any tight space.
When used for thermal management, the ATS-18A-70-C1-R0 heat sink is capable of dispersing great amounts of heat, providing quick and reliable cooling solutions for a wide variety of applications. It is expected to remain a reliable solution for many years to come, and its efficiency also provides a substantial increase in overall system efficiency.
The specific data is subject to PDF, and the above content is for reference