| Allicdata Part #: | ATS-18A-81-C1-R0-ND |
| Manufacturer Part#: |
ATS-18A-81-C1-R0 |
| Price: | $ 3.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X20MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18A-81-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.03156 |
| 30 +: | $ 2.94945 |
| 50 +: | $ 2.78573 |
| 100 +: | $ 2.62181 |
| 250 +: | $ 2.45796 |
| 500 +: | $ 2.37602 |
| 1000 +: | $ 2.13022 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management plays an important role in a wide range of applications, from automotive electronics to advanced semiconductor devices. An effective thermal management system in an electronic system helps to ensure that the system is able to operate within its specified temperature limits. Heat sinks are typically used in electronic systems for dissipating heat away from vital components such as semiconductors and microprocessors. The ATS-18A-81-C1-R0 heat sink is a high performance heat sink which can be used for efficient thermal management of high power electronics.
The ATS-18A-81-C1-R0 heat sink is a high-density aluminum heat sink designed for use in applications requiring efficient thermal management. The device is made out of a single piece of aluminum and features fins made of grooved aluminum. The heat sink is designed in such a way that it provides plenty of surface area for efficient heat transfer. The device has an anodized finish which helps to reduce corrosion and oxidation of the aluminum fins.
The ATS-18A-81-C1-R0 heat sink is designed for use in those applications where the temperature of the components needs to be managed efficiently. It is suitable for use in a variety of applications including automotive electronics, telecommunications, lighting, power electronics, and industrial control systems. It can also be used in medical and defence applications where high-performance heat sinks are required.
The working principle of the ATS-18A-81-C1-R0 heat sink is based on the concept of heat transfer. The device follows the same principles as other types of heat sinks, with heat being dissipated away from the important components into the atmosphere. The device is designed with an airflow pattern which helps to ensure efficient heat transfer. As heat is dissipated, it is transferred away from the components to the atmosphere.
The ATS-18A-81-C1-R0 heat sink is designed to have a low profile height with a low thermal resistance. This helps to ensure that the device can effectively dissipate heat away from the electronic components with minimal effect on the overall performance of the system. The device is also designed to have a low-noise operation which makes it ideal for use in noise-sensitive applications.
The ATS-18A-81-C1-R0 heat sink is also designed to be sturdy and durable. It is resistant to shock, vibration, and other environmental elements, making it suitable for use in harsh operating conditions. The device is also resistant to thermal cycling and helps to ensure that the device can provide effective thermal management over extended periods of time.
In conclusion, the ATS-18A-81-C1-R0 heat sink is a high-performance heat sink designed for efficient thermal management in various applications. The device follows the same principles as other types of heat sinks, with heat being dissipated away from the components to the atmosphere. The device is designed with an airflow pattern which helps to ensure efficient heat transfer. The device is also designed to be sturdy and durable and resistant to shock, vibration, and other environmental elements. It is suitable for use in a variety of applications including automotive electronics, telecommunications, lighting, power electronics, and industrial control systems.
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