| Allicdata Part #: | ATS-18A-81-C3-R0-ND |
| Manufacturer Part#: |
ATS-18A-81-C3-R0 |
| Price: | $ 3.65 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X20MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18A-81-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.31695 |
| 30 +: | $ 3.22707 |
| 50 +: | $ 3.04781 |
| 100 +: | $ 2.86858 |
| 250 +: | $ 2.68930 |
| 500 +: | $ 2.59965 |
| 1000 +: | $ 2.33071 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.22°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks involve a device that facilitates the transfer of thermal energy from one medium to another; such as in the cooling of electronics and other sensitive equipment, heat sinks are used to dissipate heat from the component to the surrounding environment. The ATS-18A-81-C3-R0 heat sink is a device designed specifically to improve the heat transfer from electronic components, such as integrated circuits, transistors, and resistors.
The ATS-18A-81-C3-R0 is designed for use in a wide variety of applications, such as automotive, industrial, and home applications. It can be used as a primary or secondary cooler in a thermal system, or can be used as a finned heat sink in a cooling system.
The design of the ATS-18A-81-C3-R0 heat sink is based on the principles of convection, conduction, and radiation. Convection is the heat transfer mechanism from the component\'s surface to the environment through heated gas or air that moves from the cooler to the warmer regions. Heat is dissipated through conduction, where heat transfer occurs from the hotter to the cooler regions through direct physical contact. Radiation is the third heat transfer mechanism, where infrared radiation is transferred from the hotter to the cooler surfaces.
The ATS-18A-81-C3-R0 has a finned pattern design, which makes it an ideal heat sink for a range of applications. The fins are made from copper or aluminum, providing a large thermal contact surface area that dissipates heat. Additionally, the finned design increases the air velocity over the fins, which helps to draw heat away from the hot spots. This helps to reduce the temperatures of the device, which is essential in maintaining reliable performance.
The ATS-18A-81-C3-R0 also features a number of advantages, such as: increased lifetime performance, improved heat transfer characteristics, and an improved airflow that helps to cool the device. Additionally, the ATS-18A-81-C3-R0 is a cost-effective solution for cooling electronic components.
The ATS-18A-81-C3-R0 is an ideal choice for a range of applications, due to its extensive range of features and advantages. Its finned design helps to improve thermal characteristics and reduce device temperatures, along with increased lifetime performance and better airflow. Additionally, its cost-effective design makes it an attractive option for those seeking an efficient heat-dissipating and cooling solution for their electronic components.
The specific data is subject to PDF, and the above content is for reference