Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	20.15°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-18B-06-C1-R0 Application Field and Working Principle

Thermal management is an essential feature of modern electronics. The ATS-18B-06-C1-R0 is a heat sink designed to improve the abilities of an electronic device to manage thermal energy, allowing for improved heat dissipation. This article will discuss the application field and working principle of ATS-18B-06-C1-R0.

Application Field

The ATS-18B-06-C1-R0 heat sink is designed for use in small, high-performance electronic devices such as consumer electronics, mobile phones, and tablet PCs. Its small size is ideal for smaller devices, as it can provide enhanced thermal performance without affecting device size or weight. Due to its innovative design, the ATS-18B-06-C1-R0 can improve the life of components by effectively reducing temperatures and heat stress.In addition, the ATS-18B-06-C1-R0 heat sink is suitable for military applications such as missiles and radars. When these systems are subjected to extreme temperatures, the ATS-18B-06-C1-R0 is able to provide the necessary cooling to prevent overheating and damage.

Working Principle

The ATS-18B-06-C1-R0 is a passive heat sink, which means it does not require any external power for cooling. Instead, the heat sink uses advanced directional fins and internal design to dissipate ambient air over its surface. The fins direct air over the heat source, cooling the device as the air passes. The increased surface area of the highlighted fin structure allows for higher rates of cooling and less air resistance.In addition, the ATS-18B-06-C1-R0 uses a special thermal interface material (TIM) that is applied between the heat source and the heat sink for improved heat conduction. The TIM increases thermal performance by reducing the resistance between the two surfaces. Heat is dissipated from the assembly if the temperature of the surfaces remain lower than the maximum operation temperature.

Conclusion

The ATS-18B-06-C1-R0 is a small, efficient heat sink designed for use in small, high-performance electronic devices. It can also be used in military applications. The ATS-18B-06-C1-R0 uses directional fins to direct ambient air over the heat source and a TIM to improve heat conduction. This allows the device to effectively reduce temperatures and heat stress, extending the life of the components.

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