| Allicdata Part #: | ATS-18B-11-C3-R0-ND |
| Manufacturer Part#: |
ATS-18B-11-C3-R0 |
| Price: | $ 3.83 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18B-11-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.48138 |
| 30 +: | $ 3.28818 |
| 50 +: | $ 3.09481 |
| 100 +: | $ 2.90134 |
| 250 +: | $ 2.70791 |
| 500 +: | $ 2.51449 |
| 1000 +: | $ 2.46614 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.86°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is essential for the optimal performance of any electronic device. Heat sinks are designed to improve the thermal management of these devices and promote efficient cooling. The ATS-18B-11-C3-R0 is one such heat sink designed to manage the overall temperature of electronic devices.
The ATS-18B-11-C3-R0 is a three-layer aluminum oxide heat sink. It is designed to operate in a temperature range of -55 degrees to 170 degrees Celsius. The heat sink is constructed with an aluminum base and two layers of aluminum oxide insulation over the base. The aluminum base has a series of deep grooves to allow for efficient airflow. The thermal performance is further enhanced by two layers of finned heat pipes, which are designed to transfer heat from the base to a large cooling area on the top of the heat sink.
The ATS-18B-11-C3-R0 has a maximum thermal resistance of 0.05 K/W, making it ideal for a range of applications. This heat sink has the capability to dissipate heat from up to four sources. It is ideal for applications such as processor heatsinks, high power devices, and VRMs. The heat sink\'s three-layer construction and finned heat pipes provide superior thermal performance and reliability in demanding conditions.
The ATS-18B-11-C3-R0 is designed to offer efficient cooling capabilities with minimal noise. It has a low operating noise level of less than 20 dBA, making it suitable for use in a variety of environments. The heat sinks’ robust construction makes it well suited for use in harsh environments, such as industrial as well as consumer electronics.
To ensure optimal performance, the ATS-18B-11-C3-R0 requires the correct installation and usage. The installation of the heat sink should begin with mounting the aluminum base onto the device. The base should then be attached with high-grade screws. The layers of aluminum oxide insulation should be added over the base to ensure that the heat is evenly distributed and dissipated. The finned heat pipes should be connected to the device for optimal cooling performance.
In conclusion, the ATS-18B-11-C3-R0 is a thermal management heat sink designed to provide efficient cooling in a range of environments. It features a three-layer aluminum oxide construction and finned heat pipes for superior thermal performance and reliability. Additionally, it has a low operating noise level of less than 20 dBA, making it suitable for a variety of applications. Proper installation and usage are essential to ensure optimal performance, and this heat sink’s superior design makes it the perfect choice for any thermal management needs.
The specific data is subject to PDF, and the above content is for reference