| Allicdata Part #: | ATS-18B-116-C3-R0-ND |
| Manufacturer Part#: |
ATS-18B-116-C3-R0 |
| Price: | $ 3.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18B-116-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.26907 |
| 30 +: | $ 3.18087 |
| 50 +: | $ 3.00422 |
| 100 +: | $ 2.82744 |
| 250 +: | $ 2.65074 |
| 500 +: | $ 2.56237 |
| 1000 +: | $ 2.29730 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.26°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks
Heat sinks are devices used to dissipate heat away from an object, often in order to keep it from getting too hot. They are a common form of thermal management and are used across many different industries and applications. One of the most popular types of heat sinks is the ATS-18B-116-C3-R0. This heat sink features a thermal transfer material which allows it to effectively absorb and dissipate heat away from the object it is protecting.
Application Field
The ATS-18B-116-C3-R0 heat sink is commonly used in the electronics industry. It is a highly efficient heat sink designed to be used in applications which require effective heat transfer. This is particularly important in any system or device which includes a processor or other component which runs at a high temperature. In such systems, heat dissipation is key to preventing overheating and component failure.
The ATS-18B-116-C3-R0 is also often used in medical devices, automotive electronics, and critical servers or mainframes. Its efficient heat dissipation capabilities make it an ideal choice for any application which requires reliable heat management.
Working Principle
The ATS-18B-116-C3-R0 uses a thermal transfer material which is capable of quickly and effectively absorbing and dissipating heat away from the object it is protecting. The heat sink has a series of fins or protrusions which contact the object, providing more surface area for heat transfer. The thermal transfer material also increases the efficiency of heat transfer, allowing more heat to be moved away from the object in a shorter amount of time.
To further increase efficiency, the ATS-18B-116-C3-R0 also features a thermally conductive adhesive which helps to spread heat away from the object more uniformly. This further prevents heat from building up in one area and causing damage. Additionally, the adhesive helps to maintain a solid bond between the heat sink and the object, ensuring effective heat transfer.
Conclusion
The ATS-18B-116-C3-R0 is a popular heat sink used to effectively dissipate heat away from an object. It is often used in the electronics industry, as well as in medical devices, automotive electronics, and critical servers and mainframes. The heat sink uses a thermal transfer material and a thermally conductive adhesive to spread heat away from the object more evenly and reduce the chances of overheating and component failure.
The specific data is subject to PDF, and the above content is for reference