ATS-18B-12-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.969" (50.00mm)
Width:	1.969" (50.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.500" (12.70mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	15.93°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks: ATS-18B-12-C3-R0 Application Field and Working Principle

Heat sinks are an important part of any electronics system, so understanding the application field of the ATS-18B-12-C3-R0 and its working principles is key for any development in the field. This article is meant to offer insight on these two topics. A heat sink is a device that dissipates heat away from a device or component and into the surrounding environment. Heat sinks are typically made of metal material such as aluminum or copper and come in many shapes and sizes. Heat sinks are used in electronics such as cell phones, computers, televisions, and other consumer electronics in order to keep the temperature of the components at a safe and consistent level, allowing them to function properly. The ATS-18B-12-C3-R0 heat sink is one of the most popular in the industry, with a myriad of uses in the electronics field.The ATS-18B-12-C3-R0 heat sink is designed to dissipate heat away from heat-generating components, thus preventing them from overheating. It features an effective cooling feature that can absorb and dissipate large amounts of heat quickly and efficiently. It also has several features that make installation and maintenance easier, including a simple plug and play setup. The ATS-18B-12-C3-R0 is also designed for high performance with low noise, which makes it the perfect choice for a variety of applications, from computers and consumer electronics to automotive electronics. Despite its compact design, the ATS-18B-12-C3-R0 heat sink offers excellent heat dissipation in even the most demanding applications. The heat sink uses extended fins with many cooling channels, which increases the surface area and helps to dissipate heat faster. The wide fin spacing also ensures that air passes freely around the fins, which helps to keep temperatures down and maintain efficient heat transfer. The fins are also slanted at an angle to maximize air contact and heat transfer. The ATS-18B-12-C3-R0 is designed to be used with a variety of components, such as processors, power supplies, and power amplifiers. It is also designed to be mounted in many cases, including small form factor cases such as mini-ITX and micro-ATX cases. The heatsink also comes with a number of mounting options, including screws and screwless backplate mounts. This makes the heat sink compatible with a wide variety of chassis and motherboards. In terms of performance, the ATS-18B-12-C3-R0 offers excellent heat removal with low noise levels. The extended fins provide a large surface area for maximum heat transfer while the wide spacing between fins ensures optimal airflow. In addition, the slanted angle of the fins helps to efficiently disperse heat away from the device. This combination of features ensures that the ATS-18B-12-C3-R0 offers reliable and efficient heat dissipation, making it a great choice for any application. Overall, the ATS-18B-12-C3-R0 is a great option for any electronics project or application in need of efficient heat removal. Its ability to efficiently dissipate heat and maintain low noise levels makes it an ideal choice for many applications. Its plug and play design and numerous mounting options also make it easy to install and maintain. With its excellent performance, the ATS-18B-12-C3-R0 is an ideal option for anyone looking for quality heat dissipation in their electronics project.

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