ATS-18B-148-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	8.73°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

A thermal-heat sink is an electronic device designed to efficiently disperse heat generated by electronic components such as processors and other integrated circuits. It uses a combination of thermal conductivity and radiant-barrier technology to dissipate heat away from sensitive components, thus allowing them to function at their rated temperatures. The ATS-18B-148-C3-R0 is a type of thermal-heat sink that is specifically designed for use on processors running at high speed.

Features and Design

The ATS-18B-148-C3-R0 provides high performance by relying on a combination of two key technologies. The first is its advanced heatsink design, which features a unique shape that maximizes the amount of surface area exposed to the air. This maximizes air flow and helps to dissipate heat quickly and effectively. In addition, the design also takes advantage of the fact that hot air rises to effectively transfer heat away from the processor.The second technology is the integrated radiant-barrier technology. Unlike traditional heat sinks, which rely on air to transfer heat away from the processor, the ATS-18B-148-C3-R0 uses a specialized material that is extremely thermally conductive. This material functions as a barrier, reflecting the heat away from the processor and reducing the amount of air required to effectively dissipate heat. In addition to providing superior heat dissipation, the radiant-barrier also helps to keep the overall temperature of the processor at an acceptable level.

Installation and Setup

The ATS-18B-148-C3-R0 is designed for installation on processors with a core voltage of 1.4V. It should be installed directly on the processor\'s surface, and a special thermal paste should be used to ensure efficient heat transfer. In addition, the thermal-heat sink should be installed in an area with adequate airflow, such as an open area or open-air case.

Application Field and Working Principle

The ATS-18B-148-C3-R0 is primarily designed for use on processors running at high speed. Its advanced heatsink design and integrated thermally conductive material help to dissipate heat quickly and efficiently, thus allowing the processor to run at its rated temperature. In addition, the thermal-heat sink helps to reduce the amount of airflow necessary to ensure proper cooling, further improving the processor\'s performance.In terms of its working principle, the ATS-18B-148-C3-R0 relies on a combination of advanced heatsink design and a special type of radiant-barrier technology to maximize air flow and transfer heat away from the processor. The heatsink\'s geometry increases the amount of surface area exposed to the air, allowing for better heat transfer. At the same time, the thermally conductive material helps to reflect the heat away from the processor, reducing the amount of air needed to cool the processor.

Conclusion

The ATS-18B-148-C3-R0 is a thermal-heat sink that is specifically designed for use on processors running at high speed. It makes use of advanced thermal conductivity and radiant-barrier technology to ensure efficient heat dissipation, allowing the processor to perform at its rated temperatures. In addition, its special heatsink design allows for increased air flow, further improving heat transfer and cooling capabilities. With its combination of high performance and ease of installation, the ATS-18B-148-C3-R0 is the ideal choice for any processor running at high speed.

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