ATS-18B-162-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	3.70°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

ATS-18B-162-C3-R0 Thermal - Heat Sinks Application Field and Working PrincipleIn today’s world, the efficient use of heat in a wide variety of applications is ever more vital, especially in the field of electronics and medical instruments. Thermal heat sinks are an increasingly popular choice in thermal application management due to the combination of excellent cooling conductivity, low cost, and environmental friendliness. ATS-18B-162-C3-R0 is a thermal heat sink that offers the perfect balance of these three attributes in one attractive package.The ATS-18B-162-C3-R0 thermal heat sink is a lightweight, low-profile product designed to conduct thermal energy away from circuits and other heat sources in a wide variety of electronic and medical applications. It has an anodized aluminum construction, with a fin-style surface designed to maximize heat dissipation. The heat sink is designed to be used with a variety of other thermal management products, including fans and air coolers, to ensure the best possible performance.The working principle of the ATS-18B-162-C3-R0 thermal heat sink is based on the fact that natural convection of air helps to dissipate heat from a surface. When the air in contact with the heat sink is cooler than the heat sink itself, the air acts as a heat sink and absorbs excess heat. The heat sink is constructed so that the maximum surface area is exposed to the air, allowing more efficient dissipation of thermal energy. The combination of the cooling of the air with the emission of energy from the heat sink creates a steady thermal transfer from inside the device to outside the device.The ATS-18B-162-C3-R0 thermal heat sink is most commonly seen in applications such as PCs, laptops, and servers, where high-performance thermally-efficient components are used. It is also used in many medical devices as well, including medical imaging equipment, patient monitors, and IV machines. It is also used for cooling electronic circuits in a wide variety of devices, including automotive and military equipment.The ATS-18B-162-C3-R0 thermal heat sink is an excellent choice for any application requiring a reliable, efficient, and cost-effective solution to thermal management. Its lightweight anodized aluminum construction and fin-style design produce efficient cooling results, and its compatibility with a wide variety of other thermal management products ensures maximum performance. As a result, it is an excellent choice for any application requiring a reliable and efficient thermal solution.

The specific data is subject to PDF, and the above content is for reference