| Allicdata Part #: | ATS29855-ND |
| Manufacturer Part#: |
ATS-18B-171-C2-R0 |
| Price: | $ 3.91 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X20MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18B-171-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.55320 |
| 10 +: | $ 3.45933 |
| 25 +: | $ 3.36596 |
| 50 +: | $ 3.17898 |
| 100 +: | $ 2.99193 |
| 250 +: | $ 2.80496 |
| 500 +: | $ 2.71146 |
| 1000 +: | $ 2.43095 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.33°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-18B-171-C2-R0 thermal - heat sinks are designed for the purpose of cooling electronic components that are prone to overheating. The ATS-18B-171-C2-R0 thermal - heat sinks provide optimal dissipating qualities by allowing air flow over a larger surface area or direct contact between the sink blocks and the component itself. It is typically used in computer chips and other semiconductor components, as well as LED’s (Light Emitting Diodes). The ATS-18B-171-C2-R0 thermal - heat sinks have a low profile form factor and are made from aluminum or copper which provides excellent heat transfer capabilities.
The ATS-18B-171-C2-R0 thermal - heat sinks work by dissipating heat from an electronic component by taking advantage of the natural process of convection. Convection occurs when hot air rises up from the component, due to its lighter weight, while cold air drops down by its heavier weight. This causes a continuous circulation of air which helps to cool the component. The ATS-18B-171-C2-R0 thermal - heat sinks have a designed shape that helps to keep the hot air from the component away from other components and further disperse the heat to a larger area.
The ATS-18B-171-C2-R0 thermal - heat sink is designed to be used with the most common type of cooling fan is the sleeve bearing fan. The sleeve bearing fan is a low cost solution which offers a high degree of reliability for cooling the component at a low noise level. The fan is placed directly over the thermal - heat sink and is connected to the motherboard control. The fan draws ambient air over the component eliminating the need for a mechanical air-blower and the associated noise.
The ATS-18B-171-C2-R0 thermal - heat sink also benefits from its low profile form factor. By keeping the thermal - heat sink close to the component, more of the airflow from the fan is directed onto the component for improved cooling performance. The low profile also ensures that the component does not become blocked by other components, allowing for improved airflow to keep the component cool.
Installation of the ATS-18B-171-C2-R0 thermal - heat sink is simple and straightforward. The heat sink is mounted directly to the component by using thermal adhesive and screws. Once the heat sink has been securely mounted to the component, the fan is mounted to the top of the heat sink using screws or rivets. The fan is then connected to the motherboard control via a three-pin connector.
This type of thermal - heat sink is suitable for a wide variety of applications where cooling of components is required. The ATS-18B-171-C2-R0 thermal - heat sink is typically used to cool high power semiconductors such as computer chips, transistors, and LEDs. It is also suitable for cooling small electronic components such as diodes, capacitors, and other semiconductor devices. The low profile of this thermal - heat sink ensures that it can be used in tight places without blocking other components, allowing improved cooling performance.
The specific data is subject to PDF, and the above content is for reference