ATS-18B-19-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-18B-19-C1-R0-ND

Manufacturer Part#:

ATS-18B-19-C1-R0

Price: $ 3.79
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X54X20MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-18B-19-C1-R0 datasheetATS-18B-19-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.44673
30 +: $ 3.25542
50 +: $ 3.06394
100 +: $ 2.87242
250 +: $ 2.68093
500 +: $ 2.48943
1000 +: $ 2.44156
Stock 1000Can Ship Immediately
$ 3.79
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.126" (54.01mm)
Width: 2.126" (54.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 9.75°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Heat sinks are a type of passive cooling technology that are widely used in various electronic devices, such as computers, laptops and mobile phones, to keep them running at a safe temperature. The ATS-18B-19-C1-R0 is a powerful heat sink designed to meet the requirements of modern electronics. This article will provide an overview of the application field and working principle of the ATS-18B-19-C1-R0 heat sink.

Application Field

The ATS-18B-19-C1-R0 heat sink has been designed to meet the thermal dissipation needs of a wide range of electronics, including computers, laptops, mobile phones and gaming devices. This versatility makes the heat sink ideal for use in a variety of situations.

This heat sink is particularly well suited to laptop computers, where it can be used to effectively conduct heat away from the processor, as well as other components. This helps to ensure that the computer runs at optimal temperatures and has sufficient longevity. The sink is also ideal for high-end gaming systems, where it can be used to prevent major system performance issues due to thermal throttling.

The ATS-18B-19-C1-R0 heat sink is also useful in mobile phones as it allows for efficient cooling of the device’s components, preventing the phone from overheating and destroying itself in the process. Furthermore, this heat sink is an effective tool for protecting sensitive electronic components from damage caused by excessive heat.

Working Principle

In order to understand the working principle of the ATS-18B-19-C1-R0 heat sink, it is important to first understand how heat sinks work in general. Heat sinks work by conducting heat away from sensitive electronic components, dissipating it as quickly as possible, this can either be done passively, or actively (by the use of a fan).

The ATS-18B-19-C1-R0 is an passively cooling heat sink, which makes use of its large surface area and numerous fins to draw heat away from the components of the device it is attached to. Heat is absorbed by the heat sink and dissipated into the surrounding air by the natural process of convection. This process works thanks to the large amount of heat sinks fins, each of which is designed to maximize the flow of air and heat, thus maximizing the heat sink’s efficiency.

The ATS-18B-19-C1-R0 heat sink features a number of features that make it a particularly efficient cooling tool. These features include an anodized aluminium structure that aids heat transfer, an elevated platform for superior airflow and a set of thick metal fins that help to evenly spread the heat throughout the sink.

Conclusion

The ATS-18B-19-C1-R0 is an effective and efficient heat sink designed for use in a wide variety of applications. Its passive cooling capabilities, anodized aluminium structure, elevated platform and thick metal fins make it an ideal choice for use in laptop computers, gaming systems and mobile phones. This heat sink is an effective way to keep sensitive electronic components cool and running optimally.

The specific data is subject to PDF, and the above content is for reference

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