| Allicdata Part #: | ATS-18B-197-C3-R0-ND |
| Manufacturer Part#: |
ATS-18B-197-C3-R0 |
| Price: | $ 3.51 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18B-197-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.18591 |
| 30 +: | $ 3.09981 |
| 50 +: | $ 2.92774 |
| 100 +: | $ 2.75549 |
| 250 +: | $ 2.58325 |
| 500 +: | $ 2.49714 |
| 1000 +: | $ 2.23882 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.05°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions are essential to modern electronics. They help protect components from damage due to heat as well as optimize their performance. Heat sinks, in particular, are a commonly-used technology in the electronics industry thanks to their relative simplicity and efficiency. The ATS-18B-197-C3-R0 is a powerful heat sink designed to quickly and effectively dissipate heat from the hottest-running parts in an electronic device.
The ATS-18B-197-C3-R0 is a surface mount thermal heat sink that is designed to quickly and effectively dissipate heat. It is constructed from extruded aluminum and features an advanced internal fin structure to maximize cooling performance. This makes it ideal for applications where high heat loads are generated. The ATS-18B-197-C3-R0 has a thermal resistance of 0.24°C/W and a maximum heat dissipation of 97W, making it an excellent choice for high-performance electronic applications.
The ATS-18B-197-C3-R0 works by transferring heat away from the component using direct thermal conduction. It does this by conduction the thermal energy (heat) away from the component and dissipating it into the surrounding air. This process is known as thermal conduction, and is what makes the ATS-18B-197-C3-R0 such an effective thermal management solution. With its superior heat dissipation and thermal resistance, the ATS-18B-197-C3-R0 is perfect for applications where the most demanding thermal conditions are present.
The ATS-18B-197-C3-R0 is a highly effective heat sink for many applications. It is frequently used in computer CPUs, GPUs, ASICs, DSPs, FPGAs, power supplies, and other power electronics. In addition, it can also be applied to automotive electronics, telecommunications, industrial control, and medical devices. Its broad application range and versatility make it a very attractive option for many types of electronic devices.
The ATS-18B-197-C3-R0 is designed to be easy to use and install. It is lightweight, has a compact profile, and is available in a wide range of sizes. It is also RoHS compliant, making it an excellent choice for a wide variety of applications. The ATS-18B-197-C3-R0 is easy to deploy and can be seamlessly integrated into most existing electronic systems.
The ATS-18B-197-C3-R0 is a powerful and reliable thermal management solution and an excellent choice for heat dissipation in modern electronics. Its advanced fin structure and low thermal resistance make it ideal for high heat load applications, while its lightweight design makes it easy to install and integrate with existing systems. It is the perfect choice for applications where efficient and effective heat dissipation is necessary.
The specific data is subject to PDF, and the above content is for reference