| Allicdata Part #: | ATS-18B-202-C1-R0-ND |
| Manufacturer Part#: |
ATS-18B-202-C1-R0 |
| Price: | $ 3.25 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X6MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18B-202-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.94840 |
| 30 +: | $ 2.86860 |
| 50 +: | $ 2.70925 |
| 100 +: | $ 2.54986 |
| 250 +: | $ 2.39047 |
| 500 +: | $ 2.31079 |
| 1000 +: | $ 2.07174 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.236" (6.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.80°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are designed to improve the thermal performance of electronic components, such as CPUs, GPUs, and ASICs. ATS-18B-202-C1-R0 is a thermal solution for backplanes and daughter boards in an enclosure. It is made from a single piece of high-grade aluminum alloy and has a black anodized finish.
The ATS-18B-202-C1-R0 is designed to transfer large amounts of heat away from the enclosure, dissipating it into the surrounding environment and maintaining the temperature of a circuit board below its rated limit. This ensures reliable and optimal performance of components even under the most extreme conditions.
The heat sink works by drawing cool air in through the fins of the anodized aluminum, where it is rapidly cooled by conduction and convection. This heats the air, which then rises up, away from the heat sink, and is expelled from the enclosure. In this way, the backplane and daughter board can remain within their rated temperature range, ensuring optimal performance.
The ATS-18B-202-C1-R0 is designed to provide a reliable cooling solution for electronic components, even in the most challenging environment. It is robustly built and can withstand shocks and vibrations, making it suitable for use in a wide range of applications. Whether it is used for data centers, telecommunications, aerospace, or other mission-critical applications, the ATS-18B-202-C1-R0 will ensure reliable thermal management.
The thermal performance of the ATS-18B-202-C1-R0 will depend on the layout and design of the thermal enclosure. The thermal response of the solution will be further impacted by the airflow within the enclosure. To ensure the best cooling performance, the airflow within the enclosure should be carefully designed, taking into consideration factors such as the positioning of components, the shape of the enclosure, and the size of fans. Additionally, the fans should be placed in a strategic location to maximize airflow. This can be done by installing fans in the corners of the enclosure, at the boundaries between hot and cold zones, or in front of larger components.
The ATS-18B-202-C1-R0 is an effective and reliable thermal solution for electronics in extreme environments. Its single-piece construction and robust design ensure reliable and efficient transfer of heat away from the electronic components, ensuring optimal performance and longevity.
The specific data is subject to PDF, and the above content is for reference