| Allicdata Part #: | ATS-18B-34-C3-R0-ND |
| Manufacturer Part#: |
ATS-18B-34-C3-R0 |
| Price: | $ 5.95 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X36.83X22.86MM T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18B-34-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.35563 |
| 30 +: | $ 5.05785 |
| 50 +: | $ 4.76041 |
| 100 +: | $ 4.46286 |
| 250 +: | $ 4.16534 |
| 500 +: | $ 3.86781 |
| 1000 +: | $ 3.79343 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 1.450" (36.83mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.900" (22.86mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.40°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are a type of component used for cooling a variety of applications. The ATS-18B-34-C3-R0 is a thermal heat sink specifically designed for applications requiring large areas of cooling. This type of heat sink is often used in high power electronic components operated at elevated temperatures.
The ATS-18B-34-C3-R0 is designed to prevent parts from overheating. The heat sink uses fins to disperse heat from an area of high temperature to an area of low temperature. The fins act as barriers that make the route to transfer heat more difficult, allowing heat to be dissipated from the area of high temperature to the area of low temperature.
Heat sinks are typically used in combination with fans or cold plates to prevent overheating. This type of heat sink has a very low impedance, allowing it to function at high speeds. The heat sink also has a high thermal conductivity, making it highly efficient for dissipating heat.
The ATS-18B-34-C3-R0 is a particularly good choice for applications that require power transistors and high voltage diodes. These components are often used to provide switching logic and control in the system. The wide area of cooling offered by the ATS-18B-34-C3-R0 allows these components to function at high temperatures without failure or damage.
The ATS-18B-34-C3-R0 is designed to efficiently transfer heat from the components into the surrounding air. The heat sink has an increased surface area, allowing a larger area of contact with the surrounding air. This leads to increased cooling efficiency. The fins are spaced optimally, allowing for effective air flow around them.
The ATS-18B-34-C3-R0 also features a unique design which directs the air flow from the fin edges into the fins to allow for further cooling efficiency. The airflow created by the fins is also used to cool the base of the fin, allowing it to also cool the components.
In addition to cooling components, the ATS-18B-34-C3-R0 also acts as insulation. This insulation helps to prevent electrical interference, and to reduce the effects of vibration on the components.
The ATS-18B-34-C3-R0 is a thermal heat sink specifically designed for applications requiring large areas of cooling. This type of heat sink is highly efficient for dissipating heat, and is often used to prevent overheating of power transistors and high voltage diodes. By providing efficient transfer of heat from components, and insulation to prevent electrical interference and excessive vibration, the ATS-18B-34-C3-R0 is an ideal solution for thermal management in a variety of applications.
The specific data is subject to PDF, and the above content is for reference