| Allicdata Part #: | ATS-18B-36-C1-R0-ND |
| Manufacturer Part#: |
ATS-18B-36-C1-R0 |
| Price: | $ 5.26 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 36.83X57.6X11.43MM |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18B-36-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.73067 |
| 30 +: | $ 4.46796 |
| 50 +: | $ 4.20512 |
| 100 +: | $ 3.94235 |
| 250 +: | $ 3.67953 |
| 500 +: | $ 3.41671 |
| 1000 +: | $ 3.35100 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.450" (36.83mm) |
| Width: | 2.267" (57.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.81°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an essential factor in the performance and lifespan of many electronic components. In order to ensure that they don’t overheat and suffer undesired malfunctions, the components generally need to be cooled by some type of heat sink. One of the most popular types of heat sink is the ATS-18B-36-C1-R0. In this article, we will discuss the application field and working principle of the ATS-18B-36-C1-R0.
The ATS-18B-36-C1-R0 is a type of heat sink applicable for the cooling of various types of electronic components. It can be applied to components such as CPUs, power amplifiers, VRMs, and many other types of electronic circuits and components. It is also suitable for a wide range of applications, including both commercial and industrial applications. Furthermore, the ATS-18B-36-C1-R0 is designed to be used in both air-cooled and liquid-cooled systems.
The ATS-18B-36-C1-R0 is designed in a compact and efficient shape and features a large area for efficient heat dissipation. The overall design of the heat sink ensures that it can quickly and effectively dissipate heat from the electronic components, thus preventing them from overheating. The ATS-18B-36-C1-R0 also features a fin structure which provides increased surface area for higher heat dissipation efficiency.
The ATS-18B-36-C1-R0 features a low-resistance and low-impedance design. This ensures that the airflow is not impeded by the heat sink and that the heat is efficiently dissipated. Additionally, the ATS-18B-36-C1-R0 features high-quality aluminum fins which are designed to further enhance the heat dissipation capabilities of the heat sink.
The working principle of the ATS-18B-36-C1-R0 is based on thermodynamics. The heat generated by the electronic components is absorbed by the surface of the heat sink. This heat is then dissipated effectively into the surrounding environment, thus cooling the electronic components. The fins of the heat sink increase the surface area and allow for more heat to be dissipated. Furthermore, the airflow around the fins helps to further increase the cooling efficiency of the heat sink.
In conclusion, the ATS-18B-36-C1-R0 is an efficient type of heat sink which is suitable for a wide range of cooling applications. Its large area and fin structure ensure high efficiency heat dissipation and its low-resistance and low-impedance design make it suitable for use in air-cooled and liquid-cooled systems. Its working principle is based on thermodynamics, where the heat generated by the electronic components is absorbed by the surface of the heat sink and then dissipated into the surrounding environment.
The specific data is subject to PDF, and the above content is for reference