ATS-18B-44-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	20.28°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks: ATS-18B-44-C1-R0 Application Field and Working Principle

Thermal application fields and heat sink solutions have evolved greatly over the last decade. As technology has advanced, the need for efficient cooling strategies have become increasingly important for both residential and commercial use. To meet these demands, manufacturers have developed a vast array of thermal solutions, including the ATS-18B-44-C1-R0 thermal heat sink. This article will discuss the application fields and working principle of the ATS-18B-44-C1-R0 thermal heat sink, in order to provide insight into its capabilities and performance.The ATS-18B-44-C1-R0 is a thermal heat sink that utilizes a thermally conductive base plate and fins to effectively dissipate heat from a wide variety of materials. This thermal heat sink is designed for use in a number of different applications, ranging from automotive to industrial processes. For example, the ATS-18B-44-C1-R0 can be used for cooling electronic components such as CPUs, LEDs, and power transistors. It can also be used to cool motors, electrical cabinets, and other electrically driven components.ATS-18B-44-C1-R0 thermal heat sinks feature a robust aluminum base plate and fin structure. The base plate is made of high grade aluminum that is capable of withstanding extreme temperatures. The fins are designed to maximize the heat dissipation area of the heat sink and improve its thermal performance. The design of the fins also helps to minimize the airflow resistance, thus enhancing the overall efficiency of the heat sink.The working principle of ATS-18B-44-C1-R0 thermal heat sink relies on conduction as well as convection. Conduction is a process by which heat energy is transferred from the source to the heat sink. The base plate and fins of the ATS-18B-44-C1-R0 thermal heat sink are designed to act as a barrier and stop conduction from occurring. When heat is applied to the heat sink, the base plate and fins then absorb the heat energy and conduct it away from the source.Convection, on the other hand, is the movement of heat from warmer to cooler objects. ATS-18B-44-C1-R0 thermal heat sinks are designed to create a vacuum around the cooler areas of the heat sink. This vacuum helps to promote the transfer of heat energy from warmer to cooler objects. As the air around the heat sink gets cooler, heat energy is then drawn away from the source, and the cooling process is complete.Overall, thermal heat sinks have become an essential part of many electronics designs. The ATS-18B-44-C1-R0 is an excellent example of a thermal heat sink, designed for a wide range of applications, from automotive to industrial. Thanks to its efficient cooling performance and robust aluminum construction, the ATS-18B-44-C1-R0 is an ideal choice for any electronic component requiring effective thermal management.

The specific data is subject to PDF, and the above content is for reference