ATS-18B-45-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	14.95°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to ATS-18B-45-C1-R0

The ATS-18B-45-C1-R0 is a popular thermal - heat sink used in a variety of electronic applications. It is used primarily to dissipate heat generated by components such as processors, microcontrollers, and other electronic devices.

Application Field

The ATS-18B-45-C1-R0 has become one of the most popular thermal - heat sink solutions due to its incredible range of applications. It can be used to regulate the temperature of CPUs, GPUs, And other sensitive components in a computer. It can also be used in the cooling of car electronics such as amplifiers, starter motors, and speed controllers.

Working Principle

The primary purpose of the ATS-18B-45-C1-R0 is to dissipate heat away from electronic components which produce excess heat. It features both active and passive cooling systems which work together to regulate and maintain a safe temperature in the device or system. The active cooling system of the ATS-18B-45-C1-R0 consists of a fan and a heatsink. The fan is placed over the heatsink which helps to circulate the air around the components and sink. The fan is used to actively cool down a component by providing a constant airflow that cools the component directly.The passive cooling system works in a similar manner to the active cooling system, but without the need for a fan. It consists of a series of metal fins which act as a heatsink that helps dissipate heat away from sensitive components.

Conclusion

The ATS-18B-45-C1-R0 is a popular thermal - heat sink technology used in a wide variety of electronic applications. It is an effective cooling solution due to its combination of active and passive cooling systems, and its range of applications. It is an ideal choice for those looking for an efficient and reliable method of cooling their electronics.

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