| Allicdata Part #: | ATS-18B-45-C3-R0-ND |
| Manufacturer Part#: |
ATS-18B-45-C3-R0 |
| Price: | $ 3.44 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X20MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18B-45-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.12669 |
| 30 +: | $ 3.04206 |
| 50 +: | $ 2.87305 |
| 100 +: | $ 2.70409 |
| 250 +: | $ 2.53507 |
| 500 +: | $ 2.45056 |
| 1000 +: | $ 2.19705 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.29°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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.Heat sinks are devices that are used to decrease the temperature of electronic components by transferring heat away from them and dissipating it. The ATS-18B-45-C3-R0 is a thermal heat sink that is designed to dissipate heat generated by high-power devices. This heat sink can be used in a variety of applications such as cooling, motion control, and audio/video production.
The ATS-18B-45-C3-R0 thermal heat sink has a unique design that features an array of finned heat spreaders integrated into the design. These fins allow for maximum surface area contact with the device, allowing for more efficient thermal transfer. The fin design also ensures that the heat is evenly transferred away from the device, resulting in a more efficient cooling process.
The ATS-18B-45-C3-R0 is constructed from aluminum, which provides excellent thermal conductivity. This material has the property of transferring heat easily, so it is ideal for this type of device. Furthermore, aluminum is lightweight and relatively inexpensive, making it a great choice for this thermal heat sink.
The ATS-18B-45-C3-R0 utilizes a combination of convection cooling and thermal insulation to effectively transfer heat away from the device and into the ambient air. Convection is the process by which heat is transferred by the movement of air. The fin design allows air to pass over the surface of the device, dissipating the heat away from it. In addition, a thermal insulation material is used to reduce heat transfer by keeping the device at a lower temperature.
The ATS-18B-45-C3-R0 thermal heat sink can be used in a variety of applications, such as in cooling computer chips, motion control applications, and audio/video production. In these applications, the heat sink is mounted onto a component to dissipate the heat generated by the device. The ATS-18B-45-C3-R0\'s array of fins ensure maximum surface area contact, resulting in more efficient heat transfer and cooling.
The ATS-18B-45-C3-R0 thermal heat sink is a reliable and effective device that can be used in a variety of applications. Its unique array of fins allow for maximum surface area contact and superior thermal transfer. The lightweight aluminum construction and thermal insulation material combine to ensure that the device is kept at a lower temperature, resulting in an efficient and effective cooling process.
The specific data is subject to PDF, and the above content is for reference