| Allicdata Part #: | ATS-18B-57-C3-R0-ND |
| Manufacturer Part#: |
ATS-18B-57-C3-R0 |
| Price: | $ 3.78 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X20MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18B-57-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.43539 |
| 30 +: | $ 3.24450 |
| 50 +: | $ 3.05361 |
| 100 +: | $ 2.86278 |
| 250 +: | $ 2.67193 |
| 500 +: | $ 2.48108 |
| 1000 +: | $ 2.43337 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.30°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-18B-57-C3-R0 is a high-end thermal heat sink designed for both industrial and commercial applications. It is particularly suitable for system temperatures up to 150°C and heat dissipating materials, because of its extended surface area and superior thermal diffusion performance. This product is manufactured with advanced manufacturing techniques and top-end materials in order to provide users with superior and consistent performance.
Product Description
The ATS-18B-57-C3-R0 thermal heat sink is designed to effectively dissipate heat generated from electrical and electronic products operating at high temperatures. It is manufactured with a clip-on aluminum body and heavy-duty aluminum fins, which increase surface area while improving heat dissipation performance. The sink also features reinforced edges and corners which prevent deformation. Additionally, due to its unique design, the ATS-18B-57-C3-R0 can be used in a variety of applications including consumer, industrial, automotive, and military systems.
Product Features
- High thermal performance for high temperature applications
- Heavy-duty aluminum fins for improved heat dissipation
- Reinforced edges and corners to prevent deformation
- Robust and Chip-resistant mounting system for easy installation
- Compatibility with most standard heat sinks
- Suitable for applications in consumer, industrial, automotive, and military systems
Working Principle
The ATS-18B-57-C3-R0 thermal heat sink works by transferring heat from the component it is attached to (e.g. IC, chipset, etc.) to the fins of the heat sink. The fins then dissipate the heat into the surrounding air. The aluminum body and fins provide a large surface area for the heat to dissipate, while the unique design of the fins and body also increase the heat dissipation efficiency. Additionally, the reinforced edges and corners add stability and durability to the heat sink.
Applications
The ATS-18B-57-C3-R0 thermal heat sink is suited for a wide variety of industrial and commercial applications. It is designed for applications that operate at higher temperatures, such as consumer electronics, automotive components, industrial equipment, and military systems, and can be used for both active and passive cooling. Additionally, the sink can also be used in conjunction with other cooling components, such as heat sinks, fans, and other heat-dissipating tools, in order to expedite cooling time.
Conclusion
The ATS-18B-57-C3-R0 thermal heat sink is a high-end product designed for superior performance and reliable heat dissipation. Its clip-on aluminum body and heavy-duty aluminum fins are designed to provide a large surface area for heat dissipation, strengthening its heat-dissipating capacity while adding stability and durability. The heat sink is ideal for high temperature applications such as consumer electronics, industrial equipment, military systems, and automotive components, and can be used for both active and passive cooling.
The specific data is subject to PDF, and the above content is for reference