| Allicdata Part #: | ATS29924-ND |
| Manufacturer Part#: |
ATS-18B-59-C2-R0 |
| Price: | $ 4.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X30MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18B-59-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.13910 |
| 10 +: | $ 4.02507 |
| 25 +: | $ 3.80167 |
| 50 +: | $ 3.57802 |
| 100 +: | $ 3.35437 |
| 250 +: | $ 3.13075 |
| 500 +: | $ 2.90712 |
| 1000 +: | $ 2.85122 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.94°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-18B-59-C2-R0 application field and working principle
The ATS-18B-59-C2-R0 is a thermal heat sink designed to increase cooling performance in a variety of applications. The ATS-18B-59-C2-R0 is a three-phase heat dissipation device that uses a combination of conduction and convection to dissipate heat. The ATS-18B-59-C2-R0 consists of an aluminum baseplate with a fan and four copper fins. The baseplate has a large surface area and is attached to a hot side with a mixture of air and thermal paste. The fan circulates the air around the fins for improved heat dissipation.
The ATS-18B-59-C2-R0 is designed to work in three phases. In the first phase, the aluminum baseplate absorbs the heat and transfers it to the copper fins. The copper fins are connected to the fan, which circulates the air around the fins and dissipates the heat. Finally, the fan exhausts the hot air outside the application area.
The ATS-18B-59-C2-R0 is ideal for applications requiring a high rate of cooling and efficient heat dissipation. This thermal heat sink is most often used in electronics, such as servers, workstations, and computers. It is also used in industrial and automotive applications to help reduce component operating temperatures. Additionally, the ATS-18B-59-C2-R0 can be used in high-end gaming systems to reduce component temperatures and extend component life.
The ATS-18B-59-C2-R0 heat sink is an efficient and effective way to dissipate heat and maintain optimal temperatures in a variety of applications. It is easy to install and requires minimal maintenance. The ATS-18B-59-C2-R0 is reliable and offers long-term stability in a variety of cooling applications.
The ATS-18B-59-C2-R0 heat sink is an effective and reliable thermal heating device that can be used in many applications. It is effective in dissipating heat quickly and efficiently, and it is easy to install and maintain. With its three-phase heat dissipation process and large surface area, it is ideal for applications where cooling performance is required.
The specific data is subject to PDF, and the above content is for reference