| Allicdata Part #: | ATS-18B-62-C1-R0-ND |
| Manufacturer Part#: |
ATS-18B-62-C1-R0 |
| Price: | $ 3.48 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X15MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18B-62-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.16197 |
| 30 +: | $ 3.07671 |
| 50 +: | $ 2.90581 |
| 100 +: | $ 2.73489 |
| 250 +: | $ 2.56397 |
| 500 +: | $ 2.47851 |
| 1000 +: | $ 2.22211 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 16.45°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat sink technology is critical to thermal management applications in many industries today, such as consumer electronics, automotive, medical, and aerospace. Heat sinks are used to dissipate and transfer heat from hot components in electronics, autonics, and other devices.
The ATS-18B-62-C1-R0 heat sink is a versatile and reliable thermal management solution designed for high power applications. It is part of a series of heatsinks designed and manufactured by Advanced Thermal Solutions Inc. (ATS). ATS’s heat sinks are recognized for their superior quality, performance, and reliability.
Application field of ATS-18B-62-C1-R0
The ATS-18B-62-C1-R0 thermal heat sink is designed for use in high-powered applications. It is an ideal solution for dissipating and transferring heat from hot components, such as the CPU, GPU, and chipset, in consumer electronics, automotive, medical, and aerospace applications. It is well suited for applications such as fans, LED lighting, and power supplies.
The ATS-18B-62-C1-R0 heat sink is a robust and compact solution that offers an effective air-flow and is designed for superior thermal performance. It can be used in a variety of applications, such as cooling high-powered components, equipment, and assemblies, and is designed to provide maximum surface area for the most efficient thermal transfer.
Working Principle of ATS-18B-62-C1-R0
The working principle of the ATS-18B-62-C1-R0 heat sink is based on two principles: convection and conduction. By capitalizing on these two principles, heat can be effectively dissipated and transferred away from the hot surface, where it can cause damage to equipment or shorten its lifespan.
The ATS-18B-62-C1-R0 heat sink utilizes both passive and active cooling methods to ensure efficient thermal transfer. It takes advantage of natural convection forces, which move hot air away from the hot surface. Additionally, the heat sink features fins that increase the surface area, allowing cooler air to come in contact with the hot surface and removing more heat. The heat sink also uses fans to help disperse the hot air more efficiently.
In summary, the ATS-18B-62-C1-R0 heat sink is designed for high-powered applications and features a robust and compact design for maximum thermal transfer and superior heat dissipation. By utilizing natural convection forces and incorporating a larger surface area, this heat sink can effectively transfer heat away from components and provide superior thermal performance.
The specific data is subject to PDF, and the above content is for reference