| Allicdata Part #: | ATS-18B-74-C1-R0-ND |
| Manufacturer Part#: |
ATS-18B-74-C1-R0 |
| Price: | $ 3.17 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X15MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18B-74-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.87721 |
| 30 +: | $ 2.79909 |
| 50 +: | $ 2.64361 |
| 100 +: | $ 2.48812 |
| 250 +: | $ 2.33264 |
| 500 +: | $ 2.25488 |
| 1000 +: | $ 2.02162 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 20.28°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-18B-74-C1-R0 is a heat sink designed for a specific application field and working principle. It is used to dissipate heat from an electrical device by transferring the heat away from the device. Heat is transferred from the device to the heat sink through conduction. The ATS-18B-74-C1-R0 is designed with a special range of fins which increase the heat dissipating capability above that of other heat sinks.
The working principle of the ATS-18B-74-C1-R0 is relatively simple. It is designed to absorb any heat created by an electrical device and transfer it away from the device using its fins. As the fins absorb the heat, they become hot. The hot fins then transfer the heat away from the device through convection. This creates a cycle of heat absorption and dissipation, ensuring that the device remains cool and efficient.
The primary application field of the ATS-18B-74-C1-R0 is industrial electronics. It is often used in electronic systems which require high levels of cooling and reliability. In addition to providing heat dissipation, the ATS-18B-74-C1-R0 is also ideal for applications which require high levels of thermal efficiency.
The ATS-18B-74-C1-R0 is designed with special features which enhance its capabilities. The fins are designed to optimize surface area in contact with the air. This increases the rate of heat transfer away from the device. The fins also have an increased depth which improves their overall performance. The surface of the heat sink is designed with special grooves which allow air to circulate more easily and enhance the heat transfer rate.
Overall, the ATS-18B-74-C1-R0 is an ideal heat sink for industrial electronics. Its special range of fins and special surface features provide it with superior heat dissipating capabilities. These features make the ATS-18B-74-C1-R0 an ideal choice for applications which require high levels of thermal efficiency and reliability.
The specific data is subject to PDF, and the above content is for reference