| Allicdata Part #: | ATS-18B-76-C1-R0-ND |
| Manufacturer Part#: |
ATS-18B-76-C1-R0 |
| Price: | $ 3.28 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X25MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18B-76-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.98368 |
| 30 +: | $ 2.90325 |
| 50 +: | $ 2.74201 |
| 100 +: | $ 2.58067 |
| 250 +: | $ 2.41940 |
| 500 +: | $ 2.33875 |
| 1000 +: | $ 2.09680 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.50°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important part of any modern electronics system. It is necessary to ensure that the system does not overheat, which can lead to system damage or component failure. One of the most common solutions for thermal management is the use of a heat sink. A heat sink is a device designed to dissipate heat from a dispersed source of heat, usually an integrated circuit or other electronics component. One such heat sink is the ATS-18B-76-C1-R0 thermal heat sink.
The ATS-18B-76-C1-R0 is an aluminum heat sink designed for use with integrated circuits that generate heat up to 140 degrees Celsius. The design of the ATS-18B-76-C1-R0 features a pin fin design, which provides excellent heat dissipation characteristics. The pin fin design also helps to reduce air turbulence, which can reduce the effectiveness of other heat sinks. The heat sink is supplied with mounting screws, and can be easily mounted to a circuit board without the need for additional hardware.
The ATS-18B-76-C1-R0 operates by dissipating heat energy through a thermal conductive material. Initially, the heat is absorbed by the metal fins of the heat sink, which then dissipate the heat throughout the base of the heat sink using conduction. This helps to spread the heat across a larger surface area, thus dissipating it more quickly. Additionally, the fins of the heat sink also act as an air flow guide for the air around the heat source, helping to increase the rate of heat dissipation.
The ATS-18B-76-C1-R0 is a common choice for integrated circuits that generate heat, such as those found in computers, telecommunications equipment, and other electronics systems. The heat sink is small enough to fit in tight spaces and can be easily mounted and dismounted from the integrated circuit without the need for additional hardware. Additionally, the heat sink does not require any power source, and is an excellent choice for applications that are difficult to cool due to their size or design.
Overall, the ATS-18B-76-C1-R0 is a highly effective thermal heat sink designed for use with integrated circuits and other electronics components. Its unique pin fin design provides excellent heat dissipation characteristics, while its small size makes it ideal for tight spaces. The heat sink is supplied with mounting screws, and does not require any additional power source. It is an excellent choice for applications that require efficient thermal management.
The specific data is subject to PDF, and the above content is for reference